Jun Shibata

Person

Nagoya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,770,375
- Issue date Sep 8, 2020
- Renesas Electronics Corporation
- Jun Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having gettering layer, and method for manufactu...
- Patent number 7,582,950
- Issue date Sep 1, 2009
- Renesas Technology Corp.
- Kazuhito Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,864,587
- Issue date Mar 8, 2005
- Renesas Technology Corp.
- Jun Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 6,836,007
- Issue date Dec 28, 2004
- Renesas Technology Corp.
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor element packaged on inter...
- Patent number 6,770,980
- Issue date Aug 3, 2004
- Renesas Technology Corp.
- Jun Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed chip stack type semiconductor device
- Patent number 6,545,365
- Issue date Apr 8, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Takashi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,445,064
- Issue date Sep 3, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,256,875
- Issue date Jul 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,071,755
- Issue date Jun 6, 2000
- Mitsubushi Denki Kabushiki Kaisha
- Shinji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 6,046,071
- Issue date Apr 4, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device laminated printed circuit boards
- Patent number 6,005,289
- Issue date Dec 21, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless resin encapsulated semiconductor device
- Patent number 5,969,426
- Issue date Oct 19, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Shinji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 5,834,340
- Issue date Nov 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tape automated bonding element
- Patent number 5,731,631
- Issue date Mar 24, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yomiyuki Yama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 5,710,062
- Issue date Jan 20, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,701,033
- Issue date Dec 23, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package
- Patent number 5,554,887
- Issue date Sep 10, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having particular power distribution interconn...
- Patent number 5,309,021
- Issue date May 3, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Haruo Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sewing machine capable of forming a buttonhole in a work piece
- Patent number 5,222,449
- Issue date Jun 29, 1993
- Brother Kogyo Kabushiki Kaisha
- Kazuaki Koie
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Grant
Workpiece fabric feeding device for binder strip sewing machine
- Patent number 5,109,785
- Issue date May 5, 1992
- Brother Kogyo Kabushiki Kaisha
- Kazushi Inoue
- D05 - SEWING EMBROIDERING TUFTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190259687
- Publication date Aug 22, 2019
- RENESAS ELECTRONICS CORPORATION
- Jun SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING GETTERING LAYER, AND METHOD FOR MANUFACTU...
- Publication number 20090286354
- Publication date Nov 19, 2009
- Renesas Technology Corp.
- Kazuhito Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having gettering layer, and method for manufactu...
- Publication number 20060022321
- Publication date Feb 2, 2006
- Renesas Technology Corp.
- Kazuhito Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacture thereof
- Publication number 20040159925
- Publication date Aug 19, 2004
- RENESAS TECHNOLOGY CORP.
- Tetsuya Matsuura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device
- Publication number 20040065944
- Publication date Apr 8, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Jun Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20040061211
- Publication date Apr 1, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having semiconductor element packaged on inter...
- Publication number 20030052399
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Jun Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20020105091
- Publication date Aug 8, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-sealed chip stack type semiconductor device
- Publication number 20010035587
- Publication date Nov 1, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Takashi Kondo
- H01 - BASIC ELECTRIC ELEMENTS

Jun Shibata

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor chip having gettering layer, and method for manufactu...

Semiconductor device

Semiconductor package including stacked semiconductor chips

Semiconductor device having semiconductor element packaged on inter...

Resin-sealed chip stack type semiconductor device

Semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Plastic molded semiconductor package and method of manufacturing th...

Package for semiconductor device laminated printed circuit boards

Substrateless resin encapsulated semiconductor device

Plastic molded semiconductor package and method of manufacturing th...

Semiconductor device with tape automated bonding element

Plastic molded semiconductor package and method of manufacturing th...

Semiconductor device

Plastic molded semiconductor package

Semiconductor device having particular power distribution interconn...

Sewing machine capable of forming a buttonhole in a work piece

Workpiece fabric feeding device for binder strip sewing machine

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP HAVING GETTERING LAYER, AND METHOD FOR MANUFACTU...

Semiconductor chip having gettering layer, and method for manufactu...

Semiconductor device and method for manufacture thereof

Semiconductor device

Semiconductor package

Semiconductor device having semiconductor element packaged on inter...

DUAL PACKAGE SEMICONDUCTOR DEVICE

Resin-sealed chip stack type semiconductor device