Jun TAKASOU

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Laser diode drive circuit
- Patent number 7,457,336
- Issue date Nov 25, 2008
- Mitsubishi Electric Corporation
- Jun Takasou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package
- Patent number 7,414,300
- Issue date Aug 19, 2008
- Mitsubishi Denki Kabushiki Kaisha
- Jun Takasou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASER DIODE DRIVE CIRCUIT
- Publication number 20070263685
- Publication date Nov 15, 2007
- Mitsubishi Electric Corporation
- Jun TAKASOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded semiconductor package
- Publication number 20070069343
- Publication date Mar 29, 2007
- Mitsubishi Denki Kabushiki Kaisha
- Jun Takasou
- H01 - BASIC ELECTRIC ELEMENTS