Jun Tochihira

Person

Shizuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
- Patent number 11,818,835
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting adhesive composition, thermosetting adhesive film, an...
- Patent number 10,822,527
- Issue date Nov 3, 2020
- Tomoegawa Co., Ltd.
- Jun Tochihira
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin-clad metal foil and flexible printed wiring board
- Patent number 10,751,976
- Issue date Aug 25, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yohsuke Ishikawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer printed wiring board and multilayer metal clad laminated...
- Patent number 10,568,201
- Issue date Feb 18, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor device and adhesive sheet fo...
- Patent number 6,770,370
- Issue date Aug 3, 2004
- Tomoegawa Paper Co., Ltd.
- Naoji Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 6,395,391
- Issue date May 28, 2002
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 6,228,452
- Issue date May 8, 2001
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 6,132,865
- Issue date Oct 17, 2000
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Liquid adhesive for electronic parts and adhesive tape
- Patent number 5,863,988
- Issue date Jan 26, 1999
- Tomoegawa Paper Co., Ltd.
- Takeshi Hashimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC CHUCK DEVICE
- Publication number 20230100462
- Publication date Mar 30, 2023
- TOMOEGAWA Co., Ltd.
- Tomoya HAGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD, MULTILAYER METAL-CLAD LAMINATED BO...
- Publication number 20210176854
- Publication date Jun 10, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki TAKAHASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN-CLAD METAL FOIL AND FLEXIBLE PRINTED WIRING BOARD
- Publication number 20190061320
- Publication date Feb 28, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD.
- Yohsuke ISHIKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MULTILAYER METAL CLAD LAMINATED...
- Publication number 20180376579
- Publication date Dec 27, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD, MULTILAYER METAL-CLAD LAMINATED BO...
- Publication number 20180270945
- Publication date Sep 20, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki TAKAHASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE FILM, AN...
- Publication number 20180258324
- Publication date Sep 13, 2018
- TOMOEGAWA CO., LTD.
- Jun Tochihira
- B32 - LAYERED PRODUCTS
Information Patent Application
Adhesive composition for semiconductor device and adhesive sheet fo...
- Publication number 20030111174
- Publication date Jun 19, 2003
- Naoji Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Jun Tochihira

Person

Patents Grantslast 30 patents

Multilayer printed wiring board, multilayer metal-clad laminated bo...

Thermosetting adhesive composition, thermosetting adhesive film, an...

Resin-clad metal foil and flexible printed wiring board

Multilayer printed wiring board and multilayer metal clad laminated...

Adhesive composition for semiconductor device and adhesive sheet fo...

Adhesive tape for electronic parts

Adhesive tape for electronic parts

Adhesive tape for electronic parts

Liquid adhesive for electronic parts and adhesive tape

Patents Applicationslast 30 patents

ELECTROSTATIC CHUCK DEVICE

MULTILAYER PRINTED WIRING BOARD, MULTILAYER METAL-CLAD LAMINATED BO...

RESIN-CLAD METAL FOIL AND FLEXIBLE PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND MULTILAYER METAL CLAD LAMINATED...

MULTILAYER PRINTED WIRING BOARD, MULTILAYER METAL-CLAD LAMINATED BO...

THERMOSETTING ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE FILM, AN...

Adhesive composition for semiconductor device and adhesive sheet fo...