Jun Tsukano

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a wiring board
- Patent number 8,389,414
- Issue date Mar 5, 2013
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 8,304,918
- Issue date Nov 6, 2012
- Renesas Electronics Corporation
- Jun Tsukano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device using wiring board and their man...
- Patent number 7,911,038
- Issue date Mar 22, 2011
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,888,809
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Yuichi Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, method for manufacturing same, and semiconductor package
- Patent number 7,838,779
- Issue date Nov 23, 2010
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate and semiconductor device
- Patent number 7,745,736
- Issue date Jun 29, 2010
- NEC Electronics Corporation
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate and semiconductor device
- Patent number 7,701,726
- Issue date Apr 20, 2010
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 7,674,989
- Issue date Mar 9, 2010
- NEC Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, semiconductor device, and method of manufacturing...
- Patent number 7,649,749
- Issue date Jan 19, 2010
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light thin stacked package semiconductor device and process for fab...
- Patent number 6,762,488
- Issue date Jul 13, 2004
- NEC Electronics Corporation
- Takehiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing electronic device and electronic device
- Publication number 20110163458
- Publication date Jul 7, 2011
- RENESAS ELECTRONICS CORPORATION
- Jun Tsukano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A WIRING BOARD
- Publication number 20110136298
- Publication date Jun 9, 2011
- NEC Corporation
- Katsumi KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...
- Publication number 20100232127
- Publication date Sep 16, 2010
- NEC ELECTRONICS CORPORATION
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device
- Publication number 20100176517
- Publication date Jul 15, 2010
- NEC Electronics Corporation
- Yuichi Miyagawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100102461
- Publication date Apr 29, 2010
- NEC ELECTRONICS CORPORATION
- Yuichi Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...
- Publication number 20090315190
- Publication date Dec 24, 2009
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20090137085
- Publication date May 28, 2009
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate, semiconductor device, and method of manufacturing...
- Publication number 20080012140
- Publication date Jan 17, 2008
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and method for manufacturing the same
- Publication number 20060283629
- Publication date Dec 21, 2006
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method for manufacturing same, and semiconductor package
- Publication number 20060283625
- Publication date Dec 21, 2006
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate and semiconductor device
- Publication number 20060192287
- Publication date Aug 31, 2006
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light thin stacked package semiconductor device and process for fab...
- Publication number 20030178716
- Publication date Sep 25, 2003
- Takehiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20030119296
- Publication date Jun 26, 2003
- Jun Tsukano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Jun Tsukano

Person

Patents Grantslast 30 patents

Method of manufacturing a wiring board

Method for manufacturing electronic device and electronic device

Wiring board, semiconductor device using wiring board and their man...

Semiconductor device and method of manufacturing the same

Wiring board, method for manufacturing same, and semiconductor package

Interconnecting substrate and semiconductor device

Method of manufacturing a wiring substrate and semiconductor device

Wiring board and method for manufacturing the same

Wiring substrate, semiconductor device, and method of manufacturing...

Light thin stacked package semiconductor device and process for fab...

Patents Applicationslast 30 patents

Method for manufacturing electronic device and electronic device

METHOD OF MANUFACTURING A WIRING BOARD

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...

Electronic device

Semiconductor device and method of manufacturing the same

WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...

METHOD OF MANUFACTURING A WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Wiring substrate, semiconductor device, and method of manufacturing...

Wiring board and method for manufacturing the same

Wiring board, method for manufacturing same, and semiconductor package

Interconnecting substrate and semiconductor device

Light thin stacked package semiconductor device and process for fab...

Semiconductor device and manufacturing method for the same