Jun Woo MYUNG

Person

Suwon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package
- Patent number 11,195,790
- Issue date Dec 7, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Akihisa Kuroyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,043,449
- Issue date Jun 22, 2021
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including organic interposer
- Patent number 10,854,528
- Issue date Dec 1, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,847,476
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package with electromagnetic wave shielding
- Patent number 10,692,791
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Akihisa Kuroyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including organic interposer
- Patent number 10,541,187
- Issue date Jan 21, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,504,836
- Issue date Dec 10, 2019
- Samsung Electronics Co., Ltd.
- Akihisa Kuroyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,475,776
- Issue date Nov 12, 2019
- Samsung Electronics Co., Ltd.
- Yeong A Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of fabricating the same
- Patent number 9,521,756
- Issue date Dec 13, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Young Ki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an indented portion and manufacturing me...
- Patent number 9,305,829
- Issue date Apr 5, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a connecting member
- Patent number 9,281,257
- Issue date Mar 8, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240079284
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jun Woo MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240047327
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230012399
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Dae Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200168544
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200168565
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER
- Publication number 20200152538
- Publication date May 14, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20200083163
- Publication date Mar 12, 2020
- Samsung Electronics Co., Ltd.
- Akihisa KUROYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20190371692
- Publication date Dec 5, 2019
- Samsung Electronics Co., Ltd.
- Akihisa KUROYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190252311
- Publication date Aug 15, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Akihisa KUROYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER
- Publication number 20190139851
- Publication date May 9, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jun Woo MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190131285
- Publication date May 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yeong A KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170033039
- Publication date Feb 2, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ki Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150195950
- Publication date Jul 9, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Young Ki Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150187684
- Publication date Jul 2, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jun Woo MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150187726
- Publication date Jul 2, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Sung Keun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20150179552
- Publication date Jun 25, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jun Woo MYUNG
- H01 - BASIC ELECTRIC ELEMENTS

Jun Woo MYUNG

Person

Patents Grantslast 30 patents

Fan-out semiconductor package

Semiconductor package

Semiconductor package including organic interposer

Semiconductor package

Electronic component package with electromagnetic wave shielding

Semiconductor package including organic interposer

Fan-out semiconductor package

Fan-out semiconductor package module

Power module package and method of fabricating the same

Semiconductor package with an indented portion and manufacturing me...

Semiconductor package including a connecting member

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER

FAN-OUT SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER

FAN-OUT SEMICONDUCTOR PACKAGE MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

POWER MODULE PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF