TREA

Jun-Yi Ruan

Follow

Person

  • Taoyuan, TW
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Multi-layer film device and method
    • Patent number 12,166,128
    • Issue date Dec 10, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-layer film device and method
    • Patent number 11,777,035
    • Issue date Oct 3, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-layer film device and method
    • Patent number 11,374,127
    • Issue date Jun 28, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interconnect structure and method
    • Patent number 11,328,952
    • Issue date May 10, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Cheng Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interconnect structure and method
    • Patent number 10,840,134
    • Issue date Nov 17, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Cheng Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-layer film device and method
    • Patent number 10,727,350
    • Issue date Jul 28, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interconnect structure and method
    • Patent number 10,269,627
    • Issue date Apr 23, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Cheng Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-layer film device and method
    • Patent number 10,199,500
    • Issue date Feb 5, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interconnect structure and method
    • Patent number 9,754,822
    • Issue date Sep 5, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Cheng Chou
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-LAYER FILM DEVICE AND METHOD
    • Publication number 20240395939
    • Publication date Nov 28, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-LAYER FILM DEVICE AND METHOD
    • Publication number 20230369500
    • Publication date Nov 16, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Layer Film Device and Method
    • Publication number 20220328690
    • Publication date Oct 13, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Layer Film Device and Method
    • Publication number 20200357922
    • Publication date Nov 12, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Interconnect Structure and Method
    • Publication number 20190252246
    • Publication date Aug 15, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Cheng Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Layer Film Device and Method
    • Publication number 20180350993
    • Publication date Dec 6, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Layer Film Device and Method
    • Publication number 20180040732
    • Publication date Feb 8, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yao-Jen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Interconnect Structure and Method
    • Publication number 20170372948
    • Publication date Dec 28, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Cheng Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT STRUCTURE AND METHOD
    • Publication number 20170256445
    • Publication date Sep 7, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Cheng Chou
    • H01 - BASIC ELECTRIC ELEMENTS