JUN-YI XIAO

Person

Zhongshan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure with electronic component and method for manufact...
- Patent number 8,625,297
- Issue date Jan 7, 2014
- Ambit Microsystems (Zhongshan) Ltd.
- Jun-Yi Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT
- Publication number 20140080256
- Publication date Mar 20, 2014
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING DEVICE FOR SEMICONDUCTOR CHIP PACKAGE
- Publication number 20130071505
- Publication date Mar 21, 2013
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT WITH SOLDER BLOCKING LAYER
- Publication number 20130063864
- Publication date Mar 14, 2013
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130048351
- Publication date Feb 28, 2013
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...
- Publication number 20130021772
- Publication date Jan 24, 2013
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...
- Publication number 20120279771
- Publication date Nov 8, 2012
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD TH...
- Publication number 20110221046
- Publication date Sep 15, 2011
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS

JUN-YI XIAO

Person

Patents Grantslast 30 patents

Package structure with electronic component and method for manufact...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT

MOLDING DEVICE FOR SEMICONDUCTOR CHIP PACKAGE

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT WITH SOLDER BLOCKING LAYER

ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...

PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...

SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD TH...