Jun Young Yang

Person

Kaohsing, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Curable composition and method for manufacturing the same
- Patent number 9,416,273
- Issue date Aug 16, 2016
- Eternal Materials Co., Ltd.
- Chih Chiang Yang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package with grounding and shielding layers
- Patent number 9,236,356
- Issue date Jan 12, 2016
- Advanced Semiconductor Engineering, Inc.
- Jun-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and method for manufacturing the same
- Patent number 7,833,837
- Issue date Nov 16, 2010
- Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method
- Patent number 7,700,411
- Issue date Apr 20, 2010
- Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method
- Patent number 7,656,047
- Issue date Feb 2, 2010
- Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 7,633,170
- Issue date Dec 15, 2009
- Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having passive component disposed between sem...
- Patent number 7,166,917
- Issue date Jan 23, 2007
- Advanced Semiconductor Engineering Inc.
- Jun Young Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035127
- Publication date Feb 5, 2015
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Jun-Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20080174013
- Publication date Jul 24, 2008
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20080061407
- Publication date Mar 13, 2008
- Integrated System Solution Advanced Semiconductor Engineering, Inc.
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package and manufacturing method
- Publication number 20080042301
- Publication date Feb 21, 2008
- INTEGRATED SYSTEM SOLUTION ADVANCED SEMICONDUCTOR
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080032452
- Publication date Feb 7, 2008
- Advanced Semiconductor Engineering, Inc.
- Jun Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip package module and method of fabricating the same
- Publication number 20070257348
- Publication date Nov 8, 2007
- Advanced Semiconductor Engineering, Inc.
- Jun-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure and fabrication thereof
- Publication number 20060216868
- Publication date Sep 28, 2006
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Jun-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package and method for manufacturing the same
- Publication number 20060170096
- Publication date Aug 3, 2006
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20060145339
- Publication date Jul 6, 2006
- Jun Young Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device package and manufacturing method thereof
- Publication number 20060145361
- Publication date Jul 6, 2006
- Jun Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip image sensor package module
- Publication number 20060016973
- Publication date Jan 26, 2006
- Advanced Semiconductor Engineering, Inc.
- Jun-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package module with a leadless leadframe between chips
- Publication number 20050258518
- Publication date Nov 24, 2005
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Jun-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS

Jun Young Yang

Person

Patents Grantslast 30 patents

Curable composition and method for manufacturing the same

Semiconductor package with grounding and shielding layers

Chip scale package and method for manufacturing the same

Semiconductor device package and manufacturing method

Semiconductor device package and manufacturing method

Semiconductor device package and manufacturing method thereof

Semiconductor package having passive component disposed between sem...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD

Semiconductor device package and manufacturing method

CHIP SCALE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Multiple chip package module and method of fabricating the same

Package structure and fabrication thereof

Chip scale package and method for manufacturing the same

Semiconductor package

Semiconductor device package and manufacturing method thereof

Multi-chip image sensor package module

Image sensor package module with a leadless leadframe between chips