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Jun-Yu Yeh
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Hsinchu County, TW
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last 30 patents
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Patent Grant
Package structure and semiconductor structure thereof
Patent number
8,581,239
Issue date
Nov 12, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF
Publication number
20130187265
Publication date
Jul 25, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS