Jun ZENG

Person

  • Palo Alto, CA, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POLYMER MELT POOL CRYSTALLIZATION MEASUREMENTS

    • Publication number 20250123614
    • Publication date Apr 17, 2025
    • Hewlett-Packard Development Company, L.P.
    • Van Thai TRAN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    MODEL COMPENSATIONS

    • Publication number 20250094674
    • Publication date Mar 20, 2025
    • Hewlett-Packard Development Company, L.P.
    • Juheon LEE
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    TEMPERATURE PROFILE DEFORMATION PREDICTIONS

    • Publication number 20250068801
    • Publication date Feb 27, 2025
    • Hewlett-Packard Development Company, L.P.
    • Lei CHEN
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    POWDER DEGRADATION PREDICTIONS

    • Publication number 20250053152
    • Publication date Feb 13, 2025
    • Hewlett-Packard Development Company, L.P.
    • Jacob Tyler WRIGHT
    • G05 - CONTROLLING REGULATING
  • Information Patent Application

    POWDER DEGRADATIONS

    • Publication number 20250053153
    • Publication date Feb 13, 2025
    • Hewlett-Packard Development Company, L.P.
    • Jacob Tyler WRIGHT
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    MANUFACTURING POWDER PREDICTIONS

    • Publication number 20250036825
    • Publication date Jan 30, 2025
    • Hewlett-Packard Development Company, L.P.
    • SUNIL KOTHARI
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    LATTICE STRUCTURE THICKNESSES

    • Publication number 20250021721
    • Publication date Jan 16, 2025
    • Hewlett-Packard Development Company, L.P.
    • Wei HUANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    MODIFIABLE STRUCTURES

    • Publication number 20240389713
    • Publication date Nov 28, 2024
    • Hewlett-Packard Development Company, L.P.
    • Wei HUANG
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY
  • Information Patent Application

    BUILD VOLUME PORTIONS

    • Publication number 20240383192
    • Publication date Nov 21, 2024
    • Hewlett-Packard Development Company , L.P.
    • Juan Carlos CATANA SALAZAR
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    VERTICAL MOSFET USING A SILICON CARBIDE LAYER AND A SILICON LAYER F...

    • Publication number 20240379838
    • Publication date Nov 14, 2024
    • MaxPower Semiconductor, Inc.
    • Mohamed Darwish
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FIBER MOLDING SCREEN PORE TRAJECTORY

    • Publication number 20240352680
    • Publication date Oct 24, 2024
    • Hewlett-Packard Development Company, L.P.
    • Kok Peng Marcian LEE
    • D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
  • Information Patent Application

    VERTICAL MOSFET WITH HIGH SHORT CIRCUIT WITHSTAND TIME CAPABILITY

    • Publication number 20240339494
    • Publication date Oct 10, 2024
    • MaxPower Semiconductor, Inc.
    • Mohamed Darwish
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LATTICE STRUCTURES

    • Publication number 20240315392
    • Publication date Sep 26, 2024
    • Hewlett-Packard Development Company, L.P.
    • Wei HUANG
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    SINTERING STATE COMBINATIONS

    • Publication number 20240307968
    • Publication date Sep 19, 2024
    • HEWLETT-PACKARD DEVELPOMENT COMPANY, L.P.
    • Zi-Jiang YANG
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    MAPS TO ENCODE DISPLACEMENTS IN DIGITAL 3D MODEL

    • Publication number 20240303928
    • Publication date Sep 12, 2024
    • Hewlett-Packard Development Company, L.P.
    • Juan Carlos CATANA SALAZAR
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    OBJECT SINTERING PREDICTIONS

    • Publication number 20240293867
    • Publication date Sep 5, 2024
    • Hewlett-Packard Development Company, L.P.
    • Chuang GAN
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    DESIGN ELEMENT PLACEMENT ON 3D SURFACES

    • Publication number 20240231311
    • Publication date Jul 11, 2024
    • Hewlett-Packard Development Company, L.P.
    • Jianmin ZHENG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    3D STRUCTURES TO ENCAPSULATE BUILD MATERIAL

    • Publication number 20240227306
    • Publication date Jul 11, 2024
    • Hewlett-Packard Development Company, L.P.
    • Jacob WRIGHT
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    OBJECT SINTERING STATES

    • Publication number 20240227020
    • Publication date Jul 11, 2024
    • Hawlett-Packard Development Company, L.P.
    • Lei Chen
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    ITERATIVE MODEL COMPENSATION

    • Publication number 20240184954
    • Publication date Jun 6, 2024
    • Hewlett-Packard Development Company, L.P.
    • Carlos Alberto LOPEZ COLLIER DE LA MARLIERE
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    POWDER RECLAMATION

    • Publication number 20240168457
    • Publication date May 23, 2024
    • Hewlett-Packard Development Company, L.P.
    • JACOB TYLER WRIGHT
    • G05 - CONTROLLING REGULATING
  • Information Patent Application

    OBJECT GROUP PACKING

    • Publication number 20240168711
    • Publication date May 23, 2024
    • Hewlett-Packard Development Company, L.P.
    • Juan Carlos CATANA SALAZAR
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    DESIGN ELEMENT PLACEMENT ON 3D SURFACES

    • Publication number 20240134344
    • Publication date Apr 25, 2024
    • Hewlett-Packard Development Company, L.P.
    • Jianmin ZHENG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    3D STRUCTURES TO ENCAPSULATE BUILD MATERIAL

    • Publication number 20240131800
    • Publication date Apr 25, 2024
    • Hewlett-Packard Development Company, L.P.
    • Jacob WRIGHT
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    DETERMINING POWDER DEGRADATION

    • Publication number 20240123689
    • Publication date Apr 18, 2024
    • Hewlett-Packard Development Company, L.P.
    • Jacob WRIGHT
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    OBJECT PACKINGS WITH VOLUME SUBSETS

    • Publication number 20240103488
    • Publication date Mar 28, 2024
    • Hewlett-Packard Development Company, L.P.
    • JUAN CARLOS CATANA SALAZAR
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY
  • Information Patent Application

    OBJECT PACKING GENETIC PROCEDURES

    • Publication number 20230401357
    • Publication date Dec 14, 2023
    • JUAN CARLOS CATANA SALAZAR
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    AGENT MAP GENERATION

    • Publication number 20230401364
    • Publication date Dec 14, 2023
    • Hewlett-Packard Development Company, L.P.
    • SUNIL KOTHARI
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    OBJECT PACKINGS

    • Publication number 20230368039
    • Publication date Nov 16, 2023
    • Hewlett-Packard Development Company, L.P.
    • Juan Carlos CATANA SALAZAR
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    3D PRINTER PART PACKING

    • Publication number 20230359169
    • Publication date Nov 9, 2023
    • Hewlett-Packard Development Company, L.P.
    • Scott Alan WHITE
    • G05 - CONTROLLING REGULATING