Junde Ma

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
MEMS capping method
- Patent number 9,731,960
- Issue date Aug 15, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Lushan Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer bonding structures and wafer processing methods
- Patent number 9,640,451
- Issue date May 2, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, related manufacturing method, and related ele...
- Patent number 9,620,427
- Issue date Apr 11, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chao Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, related manufacturing method, and related ele...
- Patent number 9,352,957
- Issue date May 31, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chao Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS capping method
- Patent number 9,290,378
- Issue date Mar 22, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Lushan Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...
- Publication number 20160233138
- Publication date Aug 11, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chao ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS CAPPING METHOD
- Publication number 20160152467
- Publication date Jun 2, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- LUSHAN JIANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...
- Publication number 20160031706
- Publication date Feb 4, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chao ZHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER BONDING STRUCTURES AND WAFER PROCESSING METHODS
- Publication number 20150380327
- Publication date Dec 31, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- CHAO ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS CAPPING METHOD
- Publication number 20150298968
- Publication date Oct 22, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jiang Lushan
- B81 - MICRO-STRUCTURAL TECHNOLOGY