Junfeng Zhao

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 11,676,944
- Issue date Jun 13, 2023
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 11,024,607
- Issue date Jun 1, 2021
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 10,643,975
- Issue date May 5, 2020
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlapping stacked die package with vertical columns
- Patent number 10,629,561
- Issue date Apr 21, 2020
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlapping stacked die package with vertical columns
- Patent number 10,256,208
- Issue date Apr 9, 2019
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with molding compound
- Patent number 9,936,582
- Issue date Apr 3, 2018
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 9,899,354
- Issue date Feb 20, 2018
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible system-in-package solutions for wearable devices
- Patent number 9,778,688
- Issue date Oct 3, 2017
- Intel Corporation
- Jiamiao Tang
- A43 - FOOTWEAR
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 9,627,358
- Issue date Apr 18, 2017
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 9,589,934
- Issue date Mar 7, 2017
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 9,543,272
- Issue date Jan 10, 2017
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES
- Publication number 20230282619
- Publication date Sep 7, 2023
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES
- Publication number 20210327853
- Publication date Oct 21, 2021
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES
- Publication number 20210005577
- Publication date Jan 7, 2021
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAPPING STACKED DIE PACKAGE WITH VERTICAL COLUMNS
- Publication number 20190189585
- Publication date Jun 20, 2019
- Intel Corporation
- Junfeng ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES
- Publication number 20180145055
- Publication date May 24, 2018
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAPPING STACKED DIE PACKAGE WITH VERTICAL COLUMNS
- Publication number 20170278821
- Publication date Sep 28, 2017
- Intel Corporation
- Junfeng ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES
- Publication number 20170179082
- Publication date Jun 22, 2017
- Intel Corpration
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SYSTEM-IN-PACKAGE SOLUTIONS FOR WEARABLE DEVICES
- Publication number 20160327977
- Publication date Nov 10, 2016
- Intel Corporation
- Jiamiao Tang
- A41 - WEARING APPAREL
Information Patent Application
Wearable Personal Computer and Healthcare Devices
- Publication number 20160324487
- Publication date Nov 10, 2016
- Intel Corporation
- Mao GUO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH MOLDING COMPOUND
- Publication number 20150359100
- Publication date Dec 10, 2015
- Intel Corporation
- Junfeng Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Junfeng Zhao

Person

Patents Grantslast 30 patents

Method for interconnecting stacked semiconductor devices

Method for interconnecting stacked semiconductor devices

Method for interconnecting stacked semiconductor devices

Method for interconnecting stacked semiconductor devices

Overlapping stacked die package with vertical columns

Overlapping stacked die package with vertical columns

Integrated circuit assemblies with molding compound

Method for interconnecting stacked semiconductor devices

Flexible system-in-package solutions for wearable devices

Method for interconnecting stacked semiconductor devices

Method for interconnecting stacked semiconductor devices

Method for interconnecting stacked semiconductor devices

Patents Applicationslast 30 patents

METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES

METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES

METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES

OVERLAPPING STACKED DIE PACKAGE WITH VERTICAL COLUMNS

METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES

OVERLAPPING STACKED DIE PACKAGE WITH VERTICAL COLUMNS

METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES

FLEXIBLE SYSTEM-IN-PACKAGE SOLUTIONS FOR WEARABLE DEVICES

Wearable Personal Computer and Healthcare Devices

INTEGRATED CIRCUIT ASSEMBLIES WITH MOLDING COMPOUND