Jung Eun Kang

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a hybrid heat-radiating substrate
- Patent number 9,107,313
- Issue date Aug 11, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Chang Hyun Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-radiating substrate and manufacturing method thereof
- Patent number 8,338,714
- Issue date Dec 25, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jung Eun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-radiating substrate and method of manufacturing the same
- Patent number 8,315,056
- Issue date Nov 20, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Chang Hyun Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flexible circuit board and method of manufacturing the same
- Patent number 8,198,543
- Issue date Jun 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jung Eun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140096380
- Publication date Apr 10, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE PACKAGE
- Publication number 20130062744
- Publication date Mar 14, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130042963
- Publication date Feb 21, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hyun Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120111610
- Publication date May 10, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120073863
- Publication date Mar 29, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Eun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120067623
- Publication date Mar 22, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Keun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120000697
- Publication date Jan 5, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Eun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110303437
- Publication date Dec 15, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110304990
- Publication date Dec 15, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hyun Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110303440
- Publication date Dec 15, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110240346
- Publication date Oct 6, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Eun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110075374
- Publication date Mar 31, 2011
- Jung Eun KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jung Eun Kang

Person

Patents Grantslast 30 patents

Method of manufacturing a hybrid heat-radiating substrate

Heat-radiating substrate and manufacturing method thereof

Heat-radiating substrate and method of manufacturing the same

Rigid-flexible circuit board and method of manufacturing the same

Patents Applicationslast 30 patents

HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

POWER MODULE PACKAGE

HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME