Jung-Hau Shiu

Person

New Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,315,726
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of determining process recipes and forming a semiconductor...
- Patent number 12,087,644
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 12,074,058
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,948,798
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 11,676,852
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing bottom layer wrinkling in a semiconductor device
- Patent number 11,282,712
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hau Shiu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device and method
- Patent number 11,069,528
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-patterning to form vias with straight profiles
- Patent number 11,049,763
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Morphology of resist mask prior to etching
- Patent number 10,978,301
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method for semiconductor devices and structures resultin...
- Patent number 10,867,794
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 10,867,839
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 10,727,045
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Lin Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing bottom layer wrinkling in a semiconductor device
- Patent number 10,515,822
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hau Shiu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multi-patterning to form vias with straight profiles
- Patent number 10,510,585
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning using multiple photo multiple etch
- Patent number 10,510,584
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio gap fill
- Patent number 10,361,112
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning using multiple photo multiple etch
- Patent number 10,340,178
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning using multiple photo multiple etch
- Patent number 10,141,220
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning using multiple photo multiple etch
- Patent number 9,754,818
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-patterning to form vias with straight profiles
- Patent number 9,679,804
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning using multiple photo multiple etch
- Patent number 9,412,648
- Issue date Aug 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF DETERMINING PROCESS RECIPES AND FORMING A SEMICONDUCTOR...
- Publication number 20240363452
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240282571
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Lin Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240249942
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20230260829
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterned Semiconductor Device and Method
- Publication number 20230154753
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Determining Process Recipes and Forming a Semiconductor...
- Publication number 20220367293
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210343529
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Methods for Semiconductor Devices
- Publication number 20210134656
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device
- Publication number 20200357634
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Lin Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Patterning Method for Semiconductor Devices and Structures Resultin...
- Publication number 20200312662
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20200135462
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING BOTTOM LAYER WRINKLING IN A SEMICONDUCTOR DEVICE
- Publication number 20200135488
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hau SHIU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Multi-Patterning to Form Vias with Straight Profiles
- Publication number 20200090984
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Morphology of Resist Mask Prior to Etching
- Publication number 20200075319
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Methods for Semiconductor Devices
- Publication number 20190385902
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Patterning Using Multiple Photo Multiple Etch
- Publication number 20190326164
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device
- Publication number 20190103272
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Patterning Using Multiple Photo Multiple Etch
- Publication number 20190096752
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO GAP FILL
- Publication number 20190006227
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Patterning to Form Vias with Straight Profiles
- Publication number 20180033685
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING BOTTOM LAYER WRINKLING IN A SEMICONDUCTOR DEVICE
- Publication number 20170365561
- Publication date Dec 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hau SHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Patterning Using Multiple Photo Multiple Etch
- Publication number 20170365508
- Publication date Dec 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA PATTERNING USING MULTIPLE PHOTO MULTIPLE ETCH
- Publication number 20170200636
- Publication date Jul 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hau Shiu
- H01 - BASIC ELECTRIC ELEMENTS

Jung-Hau Shiu

Person

Patents Grantslast 30 patents

Semiconductor device and method

Methods of determining process recipes and forming a semiconductor...

Patterning methods for semiconductor devices

Semiconductor device and method

Patterning methods for semiconductor devices

Method for preventing bottom layer wrinkling in a semiconductor device

Semiconductor device and method

Multi-patterning to form vias with straight profiles

Morphology of resist mask prior to etching

Patterning method for semiconductor devices and structures resultin...

Patterning methods for semiconductor devices

Method for manufacturing a semiconductor device

Method for preventing bottom layer wrinkling in a semiconductor device

Multi-patterning to form vias with straight profiles

Via patterning using multiple photo multiple etch

High aspect ratio gap fill

Via patterning using multiple photo multiple etch

Via patterning using multiple photo multiple etch

Via patterning using multiple photo multiple etch

Multi-patterning to form vias with straight profiles

Via patterning using multiple photo multiple etch

Patents Applicationslast 30 patents

METHODS OF DETERMINING PROCESS RECIPES AND FORMING A SEMICONDUCTOR...

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD

PATTERNING METHODS FOR SEMICONDUCTOR DEVICES

Patterned Semiconductor Device and Method

Methods of Determining Process Recipes and Forming a Semiconductor...

SEMICONDUCTOR DEVICE AND METHOD

Patterning Methods for Semiconductor Devices

Method for Manufacturing a Semiconductor Device

Patterning Method for Semiconductor Devices and Structures Resultin...

SEMICONDUCTOR DEVICE AND METHOD

METHOD FOR PREVENTING BOTTOM LAYER WRINKLING IN A SEMICONDUCTOR DEVICE

Multi-Patterning to Form Vias with Straight Profiles

Morphology of Resist Mask Prior to Etching

Patterning Methods for Semiconductor Devices

Via Patterning Using Multiple Photo Multiple Etch

Method for Manufacturing a Semiconductor Device

Via Patterning Using Multiple Photo Multiple Etch

HIGH ASPECT RATIO GAP FILL

Multi-Patterning to Form Vias with Straight Profiles

METHOD FOR PREVENTING BOTTOM LAYER WRINKLING IN A SEMICONDUCTOR DEVICE

Via Patterning Using Multiple Photo Multiple Etch

VIA PATTERNING USING MULTIPLE PHOTO MULTIPLE ETCH