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Jung-Kun Kang

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  • Kaohsiung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic device
    • Patent number 12,156,336
    • Issue date Nov 26, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying Kuo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor package including processing element and I/O element
    • Patent number 12,107,074
    • Issue date Oct 1, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chang Chi Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 11,991,827
    • Issue date May 21, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Yen Ting
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic package
    • Patent number 11,967,559
    • Issue date Apr 23, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chang Chi Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Optoelectronic device
    • Patent number 11,598,927
    • Issue date Mar 7, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Jr-Wei Lin
    • G02 - OPTICS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,594,518
    • Issue date Feb 28, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Chang Chi Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip module with embedded package and method for manufacturin...
    • Patent number 7,417,322
    • Issue date Aug 26, 2008
    • Advanced Semiconductor Engineering Inc.
    • Jung-Kun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multi-chip stack package
    • Patent number 7,218,006
    • Issue date May 15, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Jung-Kun Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked chip-packaging structure
    • Patent number 7,026,709
    • Issue date Apr 11, 2006
    • Advanced Semiconductor Engineering Inc.
    • Yu-Fang Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method of ball grid array package
    • Patent number 7,015,065
    • Issue date Mar 21, 2006
    • Advanced Semiconductor Engineering, Inc.
    • Yu-Fang Tsai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE DEVICE
    • Publication number 20240345341
    • Publication date Oct 17, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • G02 - OPTICS
  • Information Patent Application

    OPTOELECTRONIC PACKAGE
    • Publication number 20240345315
    • Publication date Oct 17, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Yen TING
    • G02 - OPTICS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240332192
    • Publication date Oct 3, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Po-I WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE DEVICE AND ELECTRONIC DEVICE
    • Publication number 20240329300
    • Publication date Oct 3, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Po-I WU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240329344
    • Publication date Oct 3, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTOELECTRONIC DEVICE AND METHOD OF TRANSMITTING OPTICAL SIGNAL
    • Publication number 20240264368
    • Publication date Aug 8, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Hung-Chun KUO
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20240213205
    • Publication date Jun 27, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC MODULE AND ELECTRONIC APPARATUS
    • Publication number 20240128193
    • Publication date Apr 18, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Pao-Nan LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240130043
    • Publication date Apr 18, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Yen TING
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240055365
    • Publication date Feb 15, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Po-I WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICES
    • Publication number 20240038679
    • Publication date Feb 1, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Pao-Nan LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240038712
    • Publication date Feb 1, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240030125
    • Publication date Jan 25, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240030135
    • Publication date Jan 25, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Pao-Nan LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240023239
    • Publication date Jan 18, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240008184
    • Publication date Jan 4, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chiung-Ying KUO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICES
    • Publication number 20230420418
    • Publication date Dec 28, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Chun-Yen TING
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230207524
    • Publication date Jun 29, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Chang Chi LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE
    • Publication number 20230163077
    • Publication date May 25, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Chang Chi LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTOELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230122292
    • Publication date Apr 20, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Jr-Wei LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTOELECTRONIC DEVICE
    • Publication number 20230081194
    • Publication date Mar 16, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Jr-Wei LIN
    • G02 - OPTICS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20220392871
    • Publication date Dec 8, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Chang Chi LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-chip stack package
    • Publication number 20060091560
    • Publication date May 4, 2006
    • Jung-Kun Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-chip module with embedded package and method for manufacturin...
    • Publication number 20050230799
    • Publication date Oct 20, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Jung-Kun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Manufacturing method of ball grid array package
    • Publication number 20050090043
    • Publication date Apr 28, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Yu-Fang Tsai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STACKED CHIP-PACKAGING STRUCTURE
    • Publication number 20050023657
    • Publication date Feb 3, 2005
    • Yu-Fang Tsai
    • H01 - BASIC ELECTRIC ELEMENTS