Jung-Kuo Tu

Person

Hsin-Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
- Patent number 12,202,724
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,074,110
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,017,908
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method for making the same
- Patent number 11,851,318
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 11,807,520
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming dielectric and metal sealing layers on capping st...
- Patent number 11,772,960
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and manufacturing method thereof
- Patent number 11,516,596
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Chu Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Layer for buffer semiconductor device including microelectromechnic...
- Patent number 11,462,478
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,276,670
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 11,097,941
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 10,961,114
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image sensor device and method
- Patent number 10,510,912
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor structure and method for fabrica...
- Patent number 10,273,140
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and methods of forming same
- Patent number 10,269,586
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method
- Patent number 10,164,133
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,786,628
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method
- Patent number 9,722,109
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating MEMS devices having a plurality of cavities
- Patent number 9,561,954
- Issue date Feb 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,502,396
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,443,796
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive sensors and methods for forming the same
- Patent number 9,422,155
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image sensor device and method
- Patent number 9,318,528
- Issue date Apr 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method
- Patent number 9,159,852
- Issue date Oct 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive sensors and methods for forming the same
- Patent number 9,056,762
- Issue date Jun 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and methods of forming same
- Patent number 8,970,023
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS devices having a plurality of cavities
- Patent number 8,916,943
- Issue date Dec 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive sensors and methods for forming the same
- Patent number 8,748,999
- Issue date Jun 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240286889
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
- Publication number 20230399226
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230382718
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230382719
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220411260
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220367378
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20220340407
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220340408
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220141596
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-CHU LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210327852
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210206627
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200377362
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381366
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20190256347
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsien CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Image Sensor Device and Method
- Publication number 20190140112
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Device and Method
- Publication number 20170330979
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Trench in Packages Incorporating Hybrid Bonding
- Publication number 20170069593
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Device and Method
- Publication number 20160233347
- Publication date Aug 11, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICA...
- Publication number 20160207756
- Publication date Jul 21, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsien CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Air Trench in Packages Incorporating Hybrid Bonding
- Publication number 20160163684
- Publication date Jun 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Device and Method
- Publication number 20160035771
- Publication date Feb 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Sensors and Methods for Forming the Same
- Publication number 20150344297
- Publication date Dec 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package Structure and Methods of Forming Same
- Publication number 20150162220
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MEMS DEVICES HAVING A PLURALITY OF CAVITIES
- Publication number 20150104895
- Publication date Apr 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Image Sensor Device and Method
- Publication number 20140264698
- Publication date Sep 18, 2014
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Trench in Packages Incorporating Hybrid Bonding
- Publication number 20140264948
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Structures and Methods of Forming the Same
- Publication number 20140246708
- Publication date Sep 4, 2014
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package Structure and Methods of Forming Same
- Publication number 20140217604
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Sensors and Methods for Forming the Same
- Publication number 20140213008
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capacitive Sensors and Methods for Forming the Same
- Publication number 20130277771
- Publication date Oct 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jung-Kuo Tu

Person

Patents Grantslast 30 patents

Micro electro mechanical system (MEMs) device having metal sealing...

Method for manufacturing semiconductor device

Semiconductor structure and method for forming the same

MEMS device and method for making the same

Semiconductor structure and method for manufacturing thereof

Method of forming dielectric and metal sealing layers on capping st...

MEMS device and manufacturing method thereof

Layer for buffer semiconductor device including microelectromechnic...

Semiconductor device and manufacturing method of semiconductor device

Method of fabricating semiconductor structure

Semiconductor structure and manufacturing method for the same

Image sensor device and method

Substrate structure, semiconductor structure and method for fabrica...

Package structure and methods of forming same

Image sensor device and method

Air trench in packages incorporating hybrid bonding

Image sensor device and method

Method of fabricating MEMS devices having a plurality of cavities

Air trench in packages incorporating hybrid bonding

Air trench in packages incorporating hybrid bonding

Capacitive sensors and methods for forming the same

Image sensor device and method

Image sensor device and method

Capacitive sensors and methods for forming the same

Package structure and methods of forming same

MEMS devices having a plurality of cavities

Capacitive sensors and methods for forming the same

Patents Applicationslast 30 patents

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MEMS DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

Image Sensor Device and Method

Image Sensor Device and Method

Air Trench in Packages Incorporating Hybrid Bonding

Image Sensor Device and Method

SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICA...

Air Trench in Packages Incorporating Hybrid Bonding

Image Sensor Device and Method

Capacitive Sensors and Methods for Forming the Same

Package Structure and Methods of Forming Same

METHOD OF FABRICATING MEMS DEVICES HAVING A PLURALITY OF CAVITIES

Image Sensor Device and Method

Air Trench in Packages Incorporating Hybrid Bonding

MEMS Structures and Methods of Forming the Same

Package Structure and Methods of Forming Same

Capacitive Sensors and Methods for Forming the Same

Capacitive Sensors and Methods for Forming the Same