Jung-Nan Tseng

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Pressure monitoring system for chemical-mechanical polishing
- Patent number 6,682,399
- Issue date Jan 27, 2004
- United Microelectronics Corp.
- Chien-Hsin Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Pressure suppression device for chemical mechanical polishing machi...
- Patent number 6,676,801
- Issue date Jan 13, 2004
- United Microelectronics Corp.
- Chien-Hsin Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer pressure regulation system for polishing machine
- Patent number 6,648,729
- Issue date Nov 18, 2003
- United Microelectronics Corp.
- Chien-Hsin Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Device for detecting abnormality in chemical-mechanical polishing o...
- Patent number 6,416,615
- Issue date Jul 9, 2002
- United Microelectronics Corp.
- Chien-Hsin Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus
- Patent number 6,341,995
- Issue date Jan 29, 2002
- United Microelectronics Corp.
- Chien-Hsin Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Pad backer for polishing head of chemical mechanical polishing machine
- Patent number 6,267,654
- Issue date Jul 31, 2001
- United Microelectronics Corp.
- Chien-Hsin Lai
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Wafer pressure regulation system for polishing machine
- Publication number 20030022595
- Publication date Jan 30, 2003
- Chien-Hsin Lai
- B24 - GRINDING POLISHING
Information Patent Application
Pressure suppression device for chemical mechanical polishing machi...
- Publication number 20020153347
- Publication date Oct 24, 2002
- United Microelectronics Corp.
- Chien-Hsin Lai
- B24 - GRINDING POLISHING