Jung SeIl

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Seoul, KR

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Patents Applicationslast 30 patents

Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20220364222
- Publication date Nov 17, 2022
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20210301390
- Publication date Sep 30, 2021
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...
- Publication number 20150084178
- Publication date Mar 26, 2015
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...
- Publication number 20120326291
- Publication date Dec 27, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS