Jung Sell

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,932,933
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,434,561
- Issue date Sep 6, 2022
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit packaging system with heat spreader and method o...
- Patent number 9,093,415
- Issue date Jul 28, 2015
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with underfill and method of ma...
- Patent number 8,748,233
- Issue date Jun 10, 2014
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20240183026
- Publication date Jun 6, 2024
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...