Jung-Wei Chen

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package including electromagnetic shielding structure an...
- Patent number 11,462,485
- Issue date Oct 4, 2022
- Orient Semiconductor Electronics, Limited
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising heat spreader and manufacturing me...
- Patent number 11,462,454
- Issue date Oct 4, 2022
- Orient Semiconductor Electronics, Limited
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package comprising heat spreader
- Patent number 11,355,356
- Issue date Jun 7, 2022
- Orient Semiconductor Electronics, Limited
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER THINNING METHOD
- Publication number 20220285217
- Publication date Sep 8, 2022
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20220270981
- Publication date Aug 25, 2022
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER
- Publication number 20220199428
- Publication date Jun 23, 2022
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER AND MANUFACTURING ME...
- Publication number 20220189842
- Publication date Jun 16, 2022
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS