Jung Won PARK

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Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
- Publication number 20240373560
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR