Jung-Yu CHENG

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with gate isolation features and fabrication m...
- Patent number 12,183,799
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor device
- Patent number 12,170,279
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure field-effect transistor device with dielectric layer...
- Patent number 12,125,877
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guan-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gate isolation structure and method for f...
- Patent number 12,107,087
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructures and method for manufacturing the same
- Patent number 12,094,950
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet devices with hybrid structures and methods of fabricating...
- Patent number 12,009,261
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-insulated semiconductor device
- Patent number 11,996,410
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with through vias and stacked redistribution...
- Patent number 11,894,341
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gate isolation features and fabrication m...
- Patent number 11,876,119
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with backside trench for metal gate definition
- Patent number 11,855,079
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure including forksheet transistors and...
- Patent number 11,855,078
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guan-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 11,855,138
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor device
- Patent number 11,710,737
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 11,705,378
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,705,408
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure field-effect transistor device and method of forming
- Patent number 11,670,550
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guan-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flyback converter for controlling on time variation
- Patent number 11,664,734
- Issue date May 30, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jung-Pei Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Portable label printer
- Patent number 11,648,783
- Issue date May 16, 2023
- TSC Auto ID Technology Co., Ltd.
- Ko-Chun Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor package having molded die and semiconductor die and m...
- Patent number 11,538,761
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructures and method for manufacturing the same
- Patent number 11,538,927
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-insulated semiconductor device
- Patent number 11,527,534
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated converter with constant voltage mode and constant current...
- Patent number 11,502,592
- Issue date Nov 15, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jung-Pei Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flyback converter for controlling on time variation
- Patent number 11,476,768
- Issue date Oct 18, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jung-Pei Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device structure
- Patent number 11,462,612
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flyback converter and control method thereof
- Patent number 11,431,252
- Issue date Aug 30, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Guan-Yu Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 11,424,199
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,404,342
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,387,118
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL GATE-ALL-AROUND DEVICE
- Publication number 20240429318
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WRAP AROUND SILICIDE LAYER
- Publication number 20240395857
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Rong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240387623
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanostructure Field-Effect Transistor Device and Method of Forming
- Publication number 20240379750
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guan-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR DEVICE
- Publication number 20240379668
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...
- Publication number 20240371774
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSTRUCTURES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240371960
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GATE ISOLATION STRUCTURE AND METHOD FOR F...
- Publication number 20240371877
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240355904
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240347591
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNEL WIDTH MODULATION
- Publication number 20240339531
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE ISOLATION AND CONNECTION OF MULTIGATE DEVICES
- Publication number 20240332387
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanosheet Devices With Hybrid Structures And Methods Of Fabricating...
- Publication number 20240321643
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICON...
- Publication number 20240313048
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-INSULATED SEMICONDUCTOR DEVICE
- Publication number 20240312994
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240234302
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...
- Publication number 20240222215
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND...
- Publication number 20240162227
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145540
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi Ning JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128232
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240096942
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240079346
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071939
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240061037
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH ISOLATI...
- Publication number 20240055478
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF
- Publication number 20240055502
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240047322
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Chips Comprising Inductor-Vias and Methods Forming th...
- Publication number 20240047509
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS

Jung-Yu CHENG

Person

Patents Grantslast 30 patents

Semiconductor device with gate isolation features and fabrication m...

Hybrid semiconductor device

Semiconductor packages and methods of forming same

Nanostructure field-effect transistor device with dielectric layer...

Semiconductor device with gate isolation structure and method for f...

Nanostructures and method for manufacturing the same

Nanosheet devices with hybrid structures and methods of fabricating...

Gap-insulated semiconductor device

Package structure comprising buffer layer for reducing thermal stre...

Semiconductor package with through vias and stacked redistribution...

Semiconductor device with gate isolation features and fabrication m...

Integrated circuit with backside trench for metal gate definition

Semiconductor device structure including forksheet transistors and...

Semiconductor device structure

Hybrid semiconductor device

Semiconductor packages and methods of forming the same

Semiconductor package

Nanostructure field-effect transistor device and method of forming

Flyback converter for controlling on time variation

Portable label printer

Semiconductor package having molded die and semiconductor die and m...

Nanostructures and method for manufacturing the same

Gap-insulated semiconductor device

Isolated converter with constant voltage mode and constant current...

Flyback converter for controlling on time variation

Semiconductor device structure

Flyback converter and control method thereof

Connector formation methods and packaged semiconductor devices

Package structure comprising buffer layer for reducing thermal stre...

Integrated circuit packages and methods of forming same

Patents Applicationslast 30 patents

VERTICAL GATE-ALL-AROUND DEVICE

SEMICONDUCTOR DEVICE WITH WRAP AROUND SILICIDE LAYER

SEMICONDUCTOR DEVICE STRUCTURE

Nanostructure Field-Effect Transistor Device and Method of Forming

HYBRID SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...

NANOSTRUCTURES AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH GATE ISOLATION STRUCTURE AND METHOD FOR F...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

CHANNEL WIDTH MODULATION

GATE ISOLATION AND CONNECTION OF MULTIGATE DEVICES

Nanosheet Devices With Hybrid Structures And Methods Of Fabricating...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICON...

GAP-INSULATED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE STRUCTURE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH ISOLATI...

SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

Packages with Chips Comprising Inductor-Vias and Methods Forming th...