Jung-Yu Lee

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package for efficient heat spreading
- Patent number 6,963,141
- Issue date Nov 8, 2005
- Jung-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal leadframe for semiconductor devices
- Patent number 6,101,101
- Issue date Aug 8, 2000
- Sampo Semiconductor Corporation
- Chung-Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral heat spreader for semiconductor package
- Patent number 5,973,407
- Issue date Oct 26, 1999
- Sampo Semiconductor Corporation
- Chung-Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure of heat slug-equipped packages and the packaging method o...
- Publication number 20010019181
- Publication date Sep 6, 2001
- Jung-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS