Junga LEE

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,237,297
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Junga Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having package substrate
- Patent number 12,205,925
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers and semiconductor packages including the same
- Patent number 11,742,294
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND A BONDING DEVICE FOR...
- Publication number 20240170448
- Publication date May 23, 2024
- Samsung Electronics Co.,Ltd.
- Sanghyeon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047411
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Junga LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS
- Publication number 20230260926
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER AND SEMICONDUCTOR MEMORY DEVICE USING THE SAME
- Publication number 20230141135
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Junga LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE
- Publication number 20220367416
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20220093519
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS