Jungbae Lee

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 11,942,455
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with capillary flow structures for direct chip at...
- Patent number 11,923,332
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with conductive underfill dams for...
- Patent number 11,887,938
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnect for semiconductor device assembly
- Patent number 11,810,894
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with embossed solder mask having non-...
- Patent number 11,688,706
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with graded modulus underfill and ass...
- Patent number 11,682,563
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 11,532,595
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with graded modulus underfill and ass...
- Patent number 11,404,289
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 11,362,071
- Issue date Jun 14, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with conductive underfill dams for...
- Patent number 11,342,277
- Issue date May 24, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with capillary flow structures for direct chip at...
- Patent number 11,264,349
- Issue date Mar 1, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnect for semiconductor device assembly
- Patent number 11,094,668
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...
- Publication number 20240282733
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
- Publication number 20240145422
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...
- Publication number 20240014083
- Publication date Jan 11, 2024
- Micron Technology, Inc.
- Hem P. Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ORGANIC MODULE FOR SEMICONDUCTOR DEVICES AND ASSOCIATED...
- Publication number 20230069208
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20230044728
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...
- Publication number 20220328326
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20220285315
- Publication date Sep 8, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20220271013
- Publication date Aug 25, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CONDUCTIVE UNDERFILL DAMS FOR...
- Publication number 20220254732
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH CAPILLARY FLOW STRUCTURES FOR DIRECT CHIP AT...
- Publication number 20220108970
- Publication date Apr 7, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH EMBOSSED SOLDER MASK AND ASSOCIA...
- Publication number 20220084971
- Publication date Mar 17, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...
- Publication number 20220068666
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20220059500
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CONDUCTIVE UNDERFILL DAMS FOR...
- Publication number 20210391277
- Publication date Dec 16, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210375822
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH CAPILLARY FLOW STRUCTURES FOR DIRECT CHIP AT...
- Publication number 20210193610
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210183811
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Jungbae Lee

Person

Patents Grantslast 30 patents

Stacked semiconductor dies for semiconductor device assemblies

Semiconductor die with capillary flow structures for direct chip at...

Semiconductor device assemblies with conductive underfill dams for...

Solderless interconnect for semiconductor device assembly

Semiconductor device assembly with embossed solder mask having non-...

Semiconductor device assembly with graded modulus underfill and ass...

Stacked semiconductor dies for semiconductor device assemblies

Semiconductor device assembly with graded modulus underfill and ass...

Stacked semiconductor dies for semiconductor device assemblies

Semiconductor device assemblies with conductive underfill dams for...

Semiconductor die with capillary flow structures for direct chip at...

Solderless interconnect for semiconductor device assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...

LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL

SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...

CONDUCTIVE ORGANIC MODULE FOR SEMICONDUCTOR DEVICES AND ASSOCIATED...

STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...

STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CONDUCTIVE UNDERFILL DAMS FOR...

SEMICONDUCTOR DIE WITH CAPILLARY FLOW STRUCTURES FOR DIRECT CHIP AT...

SEMICONDUCTOR DEVICE ASSEMBLY WITH EMBOSSED SOLDER MASK AND ASSOCIA...

SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...

STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CONDUCTIVE UNDERFILL DAMS FOR...

SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY

SEMICONDUCTOR DIE WITH CAPILLARY FLOW STRUCTURES FOR DIRECT CHIP AT...

SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY