Jungchul LEE

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus and operating method thereof
- Patent number 12,185,450
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and operating method thereof
- Patent number 11,979,973
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polarization measuring device and method of fabricating semiconduct...
- Patent number 11,946,809
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Ingi Kim
- G01 - MEASURING TESTING
Information Patent Grant
Hyperspectral imaging (HSI) apparatus and inspection apparatus incl...
- Patent number 11,898,912
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Sungho Jang
- G01 - MEASURING TESTING
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,854,892
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source and extreme ultraviolet light source system using the...
- Patent number 11,828,952
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection apparatus and system including the same
- Patent number 11,823,927
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Kyunghun Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laser beam delivery apparatus for extreme ultra violet light source
- Patent number 11,778,719
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- G02 - OPTICS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,322,405
- Issue date May 3, 2022
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for bonding semiconductor chips
- Patent number 10,629,461
- Issue date Apr 21, 2020
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for bonding semiconductor chips
- Patent number 10,083,846
- Issue date Sep 25, 2018
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for bonding semiconductor chips
- Patent number 9,704,732
- Issue date Jul 11, 2017
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrode, electrode manufactured therefrom and s...
- Patent number 9,705,014
- Issue date Jul 11, 2017
- Samsung SDI Co., Ltd.
- Ryunmin Heo
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF
- Publication number 20240251496
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEVEL SENSOR AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20240118072
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Sungho Jang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS, AND SEMICONDUCTOR EQU...
- Publication number 20240055243
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Taekjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEALTH DICING LASER DEVICE
- Publication number 20230187235
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Akinori OKUBO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL ASSEMBLY FOR ALIGNMENT INSPECTION, OPTICAL APPARATUS INCLUD...
- Publication number 20230094985
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Jiyoung CHU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLARIZATION MEASURING DEVICE AND METHOD OF FABRICATING SEMICONDUCT...
- Publication number 20230068376
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Ingi KIM
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20220208610
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPERSPECTRAL IMAGING (HSI) APPARATUS AND INSPECTION APPARATUS INCL...
- Publication number 20220170792
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Sungho Jang
- G01 - MEASURING TESTING
Information Patent Application
LIGHT SOURCE AND EXTREME ULTRAVIOLET LIGHT SOURCE SYSTEM USING THE...
- Publication number 20220066225
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER INSPECTION APPARATUS AND SYSTEM INCLUDING THE SAME
- Publication number 20220068681
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Kyunghun Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF
- Publication number 20210385932
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BEAM DELIVERY APPARATUS FOR EXTREME ULTRA VIOLET LIGHT SOURCE
- Publication number 20210219408
- Publication date Jul 15, 2021
- Samsung Electronics Co., Ltd.
- Dohyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20210159121
- Publication date May 27, 2021
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20180358247
- Publication date Dec 13, 2018
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20170287748
- Publication date Oct 5, 2017
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ELECTRODE, ELECTRODE MANUFACTURED THEREFROM AND S...
- Publication number 20170162727
- Publication date Jun 8, 2017
- Samsung SDI Co., Ltd.
- Ryunmin HEO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20130160952
- Publication date Jun 27, 2013
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- H01 - BASIC ELECTRIC ELEMENTS

Jungchul LEE

Person

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus and operating method thereof

Semiconductor manufacturing apparatus and operating method thereof

Polarization measuring device and method of fabricating semiconduct...

Hyperspectral imaging (HSI) apparatus and inspection apparatus incl...

Substrate dicing method, method of fabricating semiconductor device...

Light source and extreme ultraviolet light source system using the...

Wafer inspection apparatus and system including the same

Laser beam delivery apparatus for extreme ultra violet light source

Substrate dicing method, method of fabricating semiconductor device...

Apparatuses for bonding semiconductor chips

Apparatuses for bonding semiconductor chips

Apparatuses for bonding semiconductor chips

Method of forming electrode, electrode manufactured therefrom and s...

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF

LEVEL SENSOR AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

SEMICONDUCTOR EQUIPMENT MONITORING APPARATUS, AND SEMICONDUCTOR EQU...

STEALTH DICING LASER DEVICE

OPTICAL ASSEMBLY FOR ALIGNMENT INSPECTION, OPTICAL APPARATUS INCLUD...

POLARIZATION MEASURING DEVICE AND METHOD OF FABRICATING SEMICONDUCT...

SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...

HYPERSPECTRAL IMAGING (HSI) APPARATUS AND INSPECTION APPARATUS INCL...

LIGHT SOURCE AND EXTREME ULTRAVIOLET LIGHT SOURCE SYSTEM USING THE...

WAFER INSPECTION APPARATUS AND SYSTEM INCLUDING THE SAME

SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF

LASER BEAM DELIVERY APPARATUS FOR EXTREME ULTRA VIOLET LIGHT SOURCE

SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...

APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS

APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS

METHOD OF FORMING ELECTRODE, ELECTRODE MANUFACTURED THEREFROM AND S...

APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS