JUNGEUN KOO

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Chip-on-film packages and display apparatuses including the same
- Patent number 11,508,651
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Jungeun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film package, chip-on-film package, and package module
- Patent number 10,840,175
- Issue date Nov 17, 2020
- Samsung Electronics Co., Ltd.
- Jungeun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards including drive circuits, and related semico...
- Patent number 10,741,628
- Issue date Aug 11, 2020
- Samsung Electronics Co., Ltd.
- Minhwa Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME
- Publication number 20230077996
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jungeun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME
- Publication number 20210074622
- Publication date Mar 11, 2021
- Samsung Electronics Co., Ltd.
- Jungeun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE, CHIP-ON-FILM PACKAGE, AND PACKAGE MODULE
- Publication number 20190287888
- Publication date Sep 19, 2019
- Samsung Electronics Co., Ltd.
- Jungeun KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS INCLUDING DRIVE CIRCUITS, AND RELATED SEMICO...
- Publication number 20180026089
- Publication date Jan 25, 2018
- Samsung Electronics Co., Ltd.
- MINHWA JANG
- H01 - BASIC ELECTRIC ELEMENTS