JungHo Seo

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Icheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with encapsulant containment an...
- Patent number 8,227,903
- Issue date Jul 24, 2012
- Stats Chippac Ltd.
- Hye Ran Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULANT CONTAINMENT AN...
- Publication number 20120061859
- Publication date Mar 15, 2012
- Hye Ran Lee
- H01 - BASIC ELECTRIC ELEMENTS