Junghoon HAN

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 12,080,663
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 12,062,624
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Chulsoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including TSV and multiple insulating layers
- Patent number 12,040,231
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,817,408
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,792,976
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Dongoh Kim
Information Patent Grant
Semiconductor chip including low-k dielectric layer
- Patent number 11,776,894
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,737
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Junghoon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 11,769,742
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,758,713
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Dongoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including scribe lane and method of manufactu...
- Patent number 11,756,843
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer
- Patent number 11,616,018
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,557,556
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip formed using a cover insulation layer and semico...
- Patent number 11,362,053
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including scribe lane and method of manufactu...
- Patent number 11,342,235
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer
- Patent number 11,133,253
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,049,827
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device including edge chip and rela...
- Patent number 9,935,111
- Issue date Apr 3, 2018
- Samsung Electronics Co., Ltd.
- Eunjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device including edge chip and rela...
- Patent number 9,761,591
- Issue date Sep 12, 2017
- Samsung Electronics Co., Ltd.
- Eunjung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240363552
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Chulsoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES
- Publication number 20240274664
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Jungmin JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20240047390
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230354590
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Dongoh KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230354589
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Dongoh KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20230230915
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230209808
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Ahrang Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SPACER STRUCTURES
- Publication number 20230178634
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20230154876
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230113028
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Hyebin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220278061
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220262743
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- Chulsoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...
- Publication number 20220223485
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20220189967
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Dongoh KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20220189969
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Dongoh KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220115333
- Publication date Apr 14, 2022
- Samsung Electronics Co., Ltd.
- Junghoon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TSV AND METHOD FOR MANUFACTURING THE...
- Publication number 20220084885
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- Junghoon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER
- Publication number 20210375759
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Juik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210280541
- Publication date Sep 9, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...
- Publication number 20210175133
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210134745
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER
- Publication number 20210104462
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- Juik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20210057328
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210043591
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING EDGE CHIP AND RELA...
- Publication number 20170294440
- Publication date Oct 12, 2017
- Samsung Electronics Co., Ltd.
- Eunjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING EDGE CHIP AND RELA...
- Publication number 20170069633
- Publication date Mar 9, 2017
- Samsung Electronics Co., Ltd.
- Eunjung KIM
- H01 - BASIC ELECTRIC ELEMENTS

Junghoon HAN

Person

Patents Grantslast 30 patents

Semiconductor devices including a thick metal layer and a bump

Semiconductor devices and methods of manufacturing the same

Semiconductor device including TSV and multiple insulating layers

Semiconductor devices including a thick metal layer and a bump

Semiconductor memory device

Semiconductor chip including low-k dielectric layer

Semiconductor package

Semiconductor chip and semiconductor package including the same

Semiconductor devices

Semiconductor devices including scribe lane and method of manufactu...

Semiconductor devices including a thick metal layer

Semiconductor devices including a thick metal layer and a bump

Semiconductor chip formed using a cover insulation layer and semico...

Semiconductor devices including scribe lane and method of manufactu...

Semiconductor devices including a thick metal layer

Semiconductor devices including a thick metal layer and a bump

Method of forming semiconductor device including edge chip and rela...

Method of forming semiconductor device including edge chip and rela...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES HAVING SPACER STRUCTURES

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICES

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING TSV AND METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICES INCLUDING SCRIBE LANE AND METHOD OF MANUFACTU...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING EDGE CHIP AND RELA...

METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING EDGE CHIP AND RELA...