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Junghoon Kang

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  • Anyang-Si, KR
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20250183146
    • Publication date Jun 5, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250157874
    • Publication date May 15, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250149520
    • Publication date May 8, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250149516
    • Publication date May 8, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
    • Publication number 20250140709
    • Publication date May 1, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP
    • Publication number 20250125312
    • Publication date Apr 17, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH PHOTONIC CHIP
    • Publication number 20250123447
    • Publication date Apr 17, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • G02 - OPTICS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250125321
    • Publication date Apr 17, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
    • Publication number 20250116810
    • Publication date Apr 10, 2025
    • Samsung Electronics Co., Ltd.
    • Daegon Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250105231
    • Publication date Mar 27, 2025
    • Samsung Electronics Co., LTD
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250105235
    • Publication date Mar 27, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250102748
    • Publication date Mar 27, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • G02 - OPTICS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP
    • Publication number 20250093594
    • Publication date Mar 20, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250087651
    • Publication date Mar 13, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20250079287
    • Publication date Mar 6, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20250079320
    • Publication date Mar 6, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250062302
    • Publication date Feb 20, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250038122
    • Publication date Jan 30, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250038115
    • Publication date Jan 30, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...
    • Publication number 20250022859
    • Publication date Jan 16, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250015062
    • Publication date Jan 9, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
    • Publication number 20240429066
    • Publication date Dec 26, 2024
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240421099
    • Publication date Dec 19, 2024
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240319454
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240234268
    • Publication date Jul 11, 2024
    • Samsung Electronics Co., Ltd.
    • SEUNGWAN SHIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240213174
    • Publication date Jun 27, 2024
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240204026
    • Publication date Jun 20, 2024
    • Samsung Electronics Co., Ltd.
    • JUNGHOON KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240136261
    • Publication date Apr 25, 2024
    • Samsung Electronics Co., Ltd.
    • SEUNGWAN SHIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240055364
    • Publication date Feb 15, 2024
    • Samsung Electronics Co.,Ltd.
    • Junghoon Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230326871
    • Publication date Oct 12, 2023
    • Samsung Electronics Co., Ltd.
    • Junghoon Kang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR