Junghoon Shin

Person

Cheongjoo-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for directional grinding on backside of a semicon...
- Patent number 8,994,196
- Issue date Mar 31, 2015
- STATS ChipPAC, Ltd.
- SungYoon Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Ultra thin bumped wafer with under-film
- Patent number 8,704,366
- Issue date Apr 22, 2014
- STATS ChipPAC, Ltd.
- Junghoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra thin bumped wafer with under-film
- Patent number 8,329,554
- Issue date Dec 11, 2012
- STATS ChipPAC, Ltd.
- Junghoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with conductive pillars and met...
- Patent number 8,232,141
- Issue date Jul 31, 2012
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grooving bumped wafer pre-underfill system
- Patent number 8,030,769
- Issue date Oct 4, 2011
- STATS ChipPAC, Ltd.
- Junghoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with conductive pillars and met...
- Patent number 7,923,304
- Issue date Apr 12, 2011
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for directional grinding on backside of a semiconductor wafer
- Patent number 7,892,072
- Issue date Feb 22, 2011
- STATS ChipPAC, Ltd.
- SungYoon Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Ultra thin bumped wafer with under-film
- Patent number 7,838,391
- Issue date Nov 23, 2010
- STATS ChipPAC, Ltd.
- Junghoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grooving bumped wafer pre-underfill system
- Patent number 7,727,875
- Issue date Jun 1, 2010
- STATS ChipPAC, Ltd.
- Junghoon Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...
- Publication number 20110180935
- Publication date Jul 28, 2011
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Directional Grinding on Backside of a Semicon...
- Publication number 20110101546
- Publication date May 5, 2011
- STATS ChipPAC, Ltd.
- SungYoon Lee
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...
- Publication number 20110057308
- Publication date Mar 10, 2011
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra Thin Bumped Wafer With Under-Film
- Publication number 20110045637
- Publication date Feb 24, 2011
- STATS ChipPAC, Ltd.
- Junghoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra Thin Bumped Wafer With Under-Film
- Publication number 20110037172
- Publication date Feb 17, 2011
- STATS ChipPAC, Ltd.
- Junghoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grooving Bumped Wafer Pre-Underfill System
- Publication number 20100200986
- Publication date Aug 12, 2010
- STATS ChipPAC, Ltd.
- Junghoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Directional Grinding on Backside of a Semicon...
- Publication number 20090068933
- Publication date Mar 12, 2009
- STATS ChipPAC, Ltd.
- SungYoon Lee
- B24 - GRINDING POLISHING
Information Patent Application
Grooving Bumped Wafer Pre-Underfill System
- Publication number 20080318396
- Publication date Dec 25, 2008
- STATS ChipPAC, Ltd.
- Junghoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra Thin Bumped Wafer with Under-Film
- Publication number 20080280422
- Publication date Nov 13, 2008
- STATS ChipPAC, Ltd.
- Junghoon Shin
- H01 - BASIC ELECTRIC ELEMENTS

Junghoon Shin

Person

Patents Grantslast 30 patents

System and method for directional grinding on backside of a semicon...

Ultra thin bumped wafer with under-film

Ultra thin bumped wafer with under-film

Integrated circuit packaging system with conductive pillars and met...

Grooving bumped wafer pre-underfill system

Integrated circuit packaging system with conductive pillars and met...

Method for directional grinding on backside of a semiconductor wafer

Ultra thin bumped wafer with under-film

Grooving bumped wafer pre-underfill system

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...

System and Method for Directional Grinding on Backside of a Semicon...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...

Ultra Thin Bumped Wafer With Under-Film

Ultra Thin Bumped Wafer With Under-Film

Grooving Bumped Wafer Pre-Underfill System

System and Method for Directional Grinding on Backside of a Semicon...

Grooving Bumped Wafer Pre-Underfill System

Ultra Thin Bumped Wafer with Under-Film