JUNGLAE JUNG

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CHUNGCHEONGNAM-DO, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing package-on-package device and bonding appar...
- Patent number 11,776,946
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Junho Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing package-on-package device and bonding appar...
- Patent number 10,998,303
- Issue date May 4, 2021
- Samsung Electronics Co., Ltd.
- Junho Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING PACKAGE-ON-PACKAGE DEVICE AND BONDING APPAR...
- Publication number 20210225829
- Publication date Jul 22, 2021
- Samsung Electronics Co., Ltd.
- JUNHO CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGE-ON-PACKAGE DEVICE AND BONDING APPAR...
- Publication number 20190273074
- Publication date Sep 5, 2019
- Samsung Electronic Co., Ltd.
- JUNHO CHO
- H01 - BASIC ELECTRIC ELEMENTS