Jungmin KO

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 12,154,881
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package with increased package reliability
- Patent number 11,756,935
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Insup Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,721,601
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,658,160
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 11,640,951
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with chip end design and trenches to control...
- Patent number 11,469,099
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,257,794
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Hyeonjun Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN
- Publication number 20230223374
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Yunrae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220139881
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Hyeonjun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE WITH INCREASED PACKAGE RELIABILITY
- Publication number 20210398947
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Insup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210265315
- Publication date Aug 26, 2021
- Samsung Electronics Co., Ltd.
- Hyeonjun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210210397
- Publication date Jul 8, 2021
- Samsung Electronics Co., Ltd.
- HYEONGMUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210143008
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN
- Publication number 20210066231
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Yunrae CHO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit device having redistribution pattern

Chip-stacked semiconductor package with increased package reliability

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Integrated circuit device having redistribution pattern

Semiconductor package with chip end design and trenches to control...

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP-STACKED SEMICONDUCTOR PACKAGE WITH INCREASED PACKAGE RELIABILITY

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN