Jungmin KO

Person

San Jacinto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective removal of silicon-containing materials
- Patent number 11,437,242
- Issue date Sep 6, 2022
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Footing removal for nitride spacer
- Patent number 10,629,473
- Issue date Apr 21, 2020
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiN spacer profile patterning
- Patent number 10,600,639
- Issue date Mar 24, 2020
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching processes
- Patent number 10,424,487
- Issue date Sep 24, 2019
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped etch profile with oxidation
- Patent number 10,403,507
- Issue date Sep 3, 2019
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap formation with damage-free copper
- Patent number 10,242,908
- Issue date Mar 26, 2019
- Applied Materials, Inc.
- Sean Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Poly directional etch by oxidation
- Patent number 10,062,575
- Issue date Aug 28, 2018
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiN spacer profile patterning
- Patent number 10,026,621
- Issue date Jul 17, 2018
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,721,807
- Issue date Aug 1, 2017
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming features in a material layer utilizing a combin...
- Patent number 9,543,163
- Issue date Jan 10, 2017
- Applied Materials, Inc.
- Mang-Mang Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling Fin recess loading
- Patent number 9,520,302
- Issue date Dec 13, 2016
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,478,433
- Issue date Oct 25, 2016
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a self-aligned contact via selective lateral etch
- Patent number 9,368,369
- Issue date Jun 14, 2016
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fin patterning
- Patent number 9,293,568
- Issue date Mar 22, 2016
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE REMOVAL OF SILICON-CONTAINING MATERIALS
- Publication number 20200168463
- Publication date May 28, 2020
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING PROCESSES
- Publication number 20190122902
- Publication date Apr 25, 2019
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiN SPACER PROFILE PATTERNING
- Publication number 20180323075
- Publication date Nov 8, 2018
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shaped Etch Profile with Oxidation
- Publication number 20180226259
- Publication date Aug 9, 2018
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiN SPACER PROFILE PATTERNING
- Publication number 20180138049
- Publication date May 17, 2018
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP FORMATION WITH DAMAGE-FREE COPPER
- Publication number 20180138075
- Publication date May 17, 2018
- Applied Materials, Inc.
- Sean Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOOTING REMOVAL FOR NITRIDE SPACER
- Publication number 20180076083
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLY DIRECTIONAL ETCH BY OXIDATION
- Publication number 20180076044
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293437
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293438
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONTROLLING FIN RECESS LOADING
- Publication number 20160133459
- Publication date May 12, 2016
- Applied Materials, Inc.
- JUNGMIN KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A SELF-ALIGNED CONTACT VIA SELECTIVE LATERAL ETCH
- Publication number 20160133480
- Publication date May 12, 2016
- Applied Materials, Inc.
- Jungmin KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FIN PATTERNING
- Publication number 20150214337
- Publication date Jul 30, 2015
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING FEATURES IN A MATERIAL LAYER UTILIZING A COMBIN...
- Publication number 20150056814
- Publication date Feb 26, 2015
- Applied Materials, Inc.
- Mang-Mang LING
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Selective removal of silicon-containing materials

Footing removal for nitride spacer

SiN spacer profile patterning

Atomic layer etching processes

Shaped etch profile with oxidation

Airgap formation with damage-free copper

Poly directional etch by oxidation

SiN spacer profile patterning

Cyclic spacer etching process with improved profile control

Methods for forming features in a material layer utilizing a combin...

Methods for controlling Fin recess loading

Cyclic spacer etching process with improved profile control

Methods for forming a self-aligned contact via selective lateral etch

Method of fin patterning

Patents Applicationslast 30 patents

SELECTIVE REMOVAL OF SILICON-CONTAINING MATERIALS

ATOMIC LAYER ETCHING PROCESSES

SiN SPACER PROFILE PATTERNING

Shaped Etch Profile with Oxidation

SiN SPACER PROFILE PATTERNING

AIRGAP FORMATION WITH DAMAGE-FREE COPPER

FOOTING REMOVAL FOR NITRIDE SPACER

POLY DIRECTIONAL ETCH BY OXIDATION

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

METHODS FOR CONTROLLING FIN RECESS LOADING

METHODS FOR FORMING A SELF-ALIGNED CONTACT VIA SELECTIVE LATERAL ETCH

METHOD OF FIN PATTERNING

METHODS FOR FORMING FEATURES IN A MATERIAL LAYER UTILIZING A COMBIN...