Jungrae Park

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Automatic kerf offset mapping and correction system for laser dicing
- Patent number 11,901,232
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Karthik Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser scribing trench opening control in wafer dicing using hybrid...
- Patent number 11,854,888
- Issue date Dec 26, 2023
- Applied Materials, Inc.
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer dicing approach using an actively-focused laser beam l...
- Patent number 11,342,226
- Issue date May 24, 2022
- Applied Materials, Inc.
- Karthik Balakrishnan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a split beam laser scribing proc...
- Patent number 11,217,536
- Issue date Jan 4, 2022
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a spatially multi-focused laser...
- Patent number 11,011,424
- Issue date May 18, 2021
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a uniform rotating beam laser sc...
- Patent number 10,903,121
- Issue date Jan 26, 2021
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mitigation of particle contamination for wafer dicing processes
- Patent number 10,661,383
- Issue date May 26, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a multiple pass laser scribing p...
- Patent number 10,535,561
- Issue date Jan 14, 2020
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mitigation of particle contamination for wafer dicing processes
- Patent number 10,363,629
- Issue date Jul 30, 2019
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a split beam laser scribing proc...
- Patent number 9,972,575
- Issue date May 15, 2018
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a rotating beam laser scribing p...
- Patent number 9,852,997
- Issue date Dec 26, 2017
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer coating
- Patent number 9,768,014
- Issue date Sep 19, 2017
- Applied Materials, Inc.
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV-cure pre-treatment of carrier film for wafer dicing using hybrid...
- Patent number 9,601,375
- Issue date Mar 21, 2017
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer dicing approach using a line shaped laser beam profile...
- Patent number 9,355,907
- Issue date May 31, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer dicing approach using a rectangular shaped two-dimensi...
- Patent number 9,349,648
- Issue date May 24, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer dicing using hybrid laser scribing and plasma etch...
- Patent number 9,299,611
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer dicing approach using an adaptive optics-controlled la...
- Patent number 9,281,244
- Issue date Mar 8, 2016
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a bessel beam shaper laser scrib...
- Patent number 9,245,803
- Issue date Jan 26, 2016
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a phase modulated laser beam pro...
- Patent number 9,196,536
- Issue date Nov 24, 2015
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using laser scribing process based on...
- Patent number 9,177,861
- Issue date Nov 3, 2015
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of die singulation using laser ablation and induction of int...
- Patent number 9,165,832
- Issue date Oct 20, 2015
- Applied Materials, Inc.
- James S. Papanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baking tool for improved wafer coating process
- Patent number 9,130,030
- Issue date Sep 8, 2015
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing method for improving die packaging quality
- Patent number 9,105,710
- Issue date Aug 11, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using hybrid laser scribing and plasma etch approach w...
- Patent number 9,012,305
- Issue date Apr 21, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer coating
- Patent number 8,991,329
- Issue date Mar 31, 2015
- Applied Materials, Inc.
- Jungrae Park
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...
- Publication number 20240079273
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MASK PATTERNING DEBRIS REMOVAL
- Publication number 20220319847
- Publication date Oct 6, 2022
- Karthik Narayanan BALAKRISHNAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING AN ACTIVELY-FOCUSED LASER BEAM L...
- Publication number 20220246476
- Publication date Aug 4, 2022
- Applied Materials, Inc.
- Karthik Balakrishnan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATIC KERF OFFSET MAPPING AND CORRECTION SYSTEM FOR LASER DICING
- Publication number 20210398853
- Publication date Dec 23, 2021
- Applied Materials, Inc.
- Karthik Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...
- Publication number 20210398854
- Publication date Dec 23, 2021
- Applied Materials, Inc.
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER...
- Publication number 20210233816
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR WAFER-LEVEL PACKAGING USING DIRECT WRITING
- Publication number 20210202334
- Publication date Jul 1, 2021
- Applied Materials, Inc.
- PENG SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING AN ACTIVELY-FOCUSED LASER BEAM L...
- Publication number 20210050262
- Publication date Feb 18, 2021
- Applied Materials, Inc.
- Karthik Balakrishnan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A UNIFORM ROTATING BEAM LASER SC...
- Publication number 20210050263
- Publication date Feb 18, 2021
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER...
- Publication number 20210043515
- Publication date Feb 11, 2021
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MITIGATION OF PARTICLE CONTAMINATION FOR WAFER DICING PROCESSES
- Publication number 20190291206
- Publication date Sep 26, 2019
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A MULTIPLE PASS LASER SCRIBING P...
- Publication number 20190279902
- Publication date Sep 12, 2019
- Applied Materials, Inc.
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MITIGATION OF PARTICLE CONTAMINATION FOR WAFER DICING PROCESSES
- Publication number 20180345418
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...
- Publication number 20180226355
- Publication date Aug 9, 2018
- Applied Materials, Inc.
- JUNGRAE PARK
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
HYBRID WAFER DICING APPROACH USING A ROTATING BEAM LASER SCRIBING P...
- Publication number 20170278801
- Publication date Sep 28, 2017
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...
- Publication number 20170256500
- Publication date Sep 7, 2017
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
UV-CURE PRE-TREATMENT OF CARRIER FILM FOR WAFER DICING USING HYBRID...
- Publication number 20160315009
- Publication date Oct 27, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING AN ADAPTIVE OPTICS-CONTROLLED LA...
- Publication number 20160086851
- Publication date Mar 24, 2016
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A RECTANGULAR SHAPED TWO-DIMENSI...
- Publication number 20160027697
- Publication date Jan 28, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING COLLIMATED LASER SCRIBING PROCES...
- Publication number 20150287638
- Publication date Oct 8, 2015
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BAKING TOOL FOR IMPROVED WAFER COATING PROCESS
- Publication number 20150255346
- Publication date Sep 10, 2015
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING TEMPORALLY-CONTROLLED LASER SCRI...
- Publication number 20150243559
- Publication date Aug 27, 2015
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED WAFER COATING
- Publication number 20150221505
- Publication date Aug 6, 2015
- Jungrae Park
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH W...
- Publication number 20150214109
- Publication date Jul 30, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING METHOD FOR IMPROVING DIE PACKAGING QUALITY
- Publication number 20150064878
- Publication date Mar 5, 2015
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Jungrae Park

Person

Patents Grantslast 30 patents

Automatic kerf offset mapping and correction system for laser dicing

Laser scribing trench opening control in wafer dicing using hybrid...

Hybrid wafer dicing approach using an actively-focused laser beam l...

Hybrid wafer dicing approach using a split beam laser scribing proc...

Hybrid wafer dicing approach using a spatially multi-focused laser...

Hybrid wafer dicing approach using a uniform rotating beam laser sc...

Mitigation of particle contamination for wafer dicing processes

Hybrid wafer dicing approach using a multiple pass laser scribing p...

Mitigation of particle contamination for wafer dicing processes

Hybrid wafer dicing approach using a split beam laser scribing proc...

Hybrid wafer dicing approach using a rotating beam laser scribing p...

Wafer coating

UV-cure pre-treatment of carrier film for wafer dicing using hybrid...

Hybrid wafer dicing approach using a line shaped laser beam profile...

Hybrid wafer dicing approach using a rectangular shaped two-dimensi...

Method of wafer dicing using hybrid laser scribing and plasma etch...

Hybrid wafer dicing approach using an adaptive optics-controlled la...

Hybrid wafer dicing approach using a bessel beam shaper laser scrib...

Hybrid wafer dicing approach using a phase modulated laser beam pro...

Hybrid wafer dicing approach using laser scribing process based on...

Method of die singulation using laser ablation and induction of int...

Baking tool for improved wafer coating process

Wafer dicing method for improving die packaging quality

Wafer dicing using hybrid laser scribing and plasma etch approach w...

Wafer coating

Patents Applicationslast 30 patents

LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...

METHODS AND APPARATUS FOR MASK PATTERNING DEBRIS REMOVAL

HYBRID WAFER DICING APPROACH USING AN ACTIVELY-FOCUSED LASER BEAM L...

AUTOMATIC KERF OFFSET MAPPING AND CORRECTION SYSTEM FOR LASER DICING

LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...

HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER...

METHODS AND APPARATUS FOR WAFER-LEVEL PACKAGING USING DIRECT WRITING

HYBRID WAFER DICING APPROACH USING AN ACTIVELY-FOCUSED LASER BEAM L...

HYBRID WAFER DICING APPROACH USING A UNIFORM ROTATING BEAM LASER SC...

HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER...

MITIGATION OF PARTICLE CONTAMINATION FOR WAFER DICING PROCESSES

HYBRID WAFER DICING APPROACH USING A MULTIPLE PASS LASER SCRIBING P...

MITIGATION OF PARTICLE CONTAMINATION FOR WAFER DICING PROCESSES

HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...

HYBRID WAFER DICING APPROACH USING A ROTATING BEAM LASER SCRIBING P...

HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...

UV-CURE PRE-TREATMENT OF CARRIER FILM FOR WAFER DICING USING HYBRID...

HYBRID WAFER DICING APPROACH USING AN ADAPTIVE OPTICS-CONTROLLED LA...

HYBRID WAFER DICING APPROACH USING A RECTANGULAR SHAPED TWO-DIMENSI...

HYBRID WAFER DICING APPROACH USING COLLIMATED LASER SCRIBING PROCES...

BAKING TOOL FOR IMPROVED WAFER COATING PROCESS

HYBRID WAFER DICING APPROACH USING TEMPORALLY-CONTROLLED LASER SCRI...

IMPROVED WAFER COATING

WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH W...

WAFER DICING METHOD FOR IMPROVING DIE PACKAGING QUALITY