Jungseok AHN

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Wafer trimming device
- Patent number 11,705,323
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Jungseok Ahn
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS AND METHOD OF MANUFAC...
- Publication number 20240063186
- Publication date Feb 22, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- SEYONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006382
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Wonjung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICAT...
- Publication number 20230130983
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Seyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230075665
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230029098
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Taehyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TRIMMING DEVICE
- Publication number 20210320000
- Publication date Oct 14, 2021
- Samsung Electronics Co., Ltd.
- Jungseok AHN
- H01 - BASIC ELECTRIC ELEMENTS