JUNGSU HA

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Osan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor chips having heat dissipation layers and gro...
- Patent number 9,978,661
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20180269126
- Publication date Sep 20, 2018
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20170047264
- Publication date Feb 16, 2017
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS