Junhe WANG

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
System in package module assembly, system in package module, and el...
- Patent number 11,133,128
- Issue date Sep 28, 2021
- Huawei Technologies Co., Ltd.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND COMMUNICATION DEVICE
- Publication number 20230299018
- Publication date Sep 21, 2023
- Huawei Technologies Co., Ltd
- Chen KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGED STRUCTURE AND MANUFACTURING METHOD THEREOF,...
- Publication number 20230238315
- Publication date Jul 27, 2023
- Huawei Technologies Co., Ltd
- Yunfei QIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF, CONVERTER, AND ELECT...
- Publication number 20230215788
- Publication date Jul 6, 2023
- Huawei Technologies Co., Ltd
- Wengang LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, PREPARATION MOLD, AND DEVICE
- Publication number 20230170269
- Publication date Jun 1, 2023
- Huawei Technologies Co., Ltd
- Fankun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT CHIP INTEGRATING TEMPERATURE SENSOR
- Publication number 20230087724
- Publication date Mar 23, 2023
- Huawei Technologies Co., Ltd
- Boning Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING EMBEDDED SUBSTRATE
- Publication number 20200066644
- Publication date Feb 27, 2020
- Huawei Technologies Co., Ltd
- KUANMING BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE MODULE ASSEMBLY, SYSTEM IN PACKAGE MODULE, AND EL...
- Publication number 20180308616
- Publication date Oct 25, 2018
- Huawei Technologies Co., Ltd
- Yuping GONG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

System in package module assembly, system in package module, and el...

Patents Applicationslast 30 patents

POWER MODULE AND POWER CONVERSION APPARATUS

PACKAGE SUBSTRATE AND COMMUNICATION DEVICE

SEMICONDUCTOR PACKAGED STRUCTURE AND MANUFACTURING METHOD THEREOF,...

POWER MODULE AND MANUFACTURING METHOD THEREOF, CONVERTER, AND ELECT...

POWER MODULE, PREPARATION MOLD, AND DEVICE

IGBT CHIP INTEGRATING TEMPERATURE SENSOR

EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING EMBEDDED SUBSTRATE

SYSTEM IN PACKAGE MODULE ASSEMBLY, SYSTEM IN PACKAGE MODULE, AND EL...