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Seoul, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming semiconductor package wi...
Patent number
11,894,314
Issue date
Feb 6, 2024
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-sided partial molded SIP module
Patent number
11,887,863
Issue date
Jan 30, 2024
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming discrete antenna modules
Patent number
11,735,539
Issue date
Aug 22, 2023
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Double-Sided Partial Molded SiP Module
Publication number
20240153783
Publication date
May 9, 2024
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
Publication number
20240128201
Publication date
Apr 18, 2024
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Discrete Antenna Modules
Publication number
20230343732
Publication date
Oct 26, 2023
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
Publication number
20230081706
Publication date
Mar 16, 2023
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Double-Sided Partial Molded SIP Module
Publication number
20230074430
Publication date
Mar 9, 2023
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Discrete Antenna Modules
Publication number
20220148983
Publication date
May 12, 2022
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS