JunHong Lee

Follow

Person

Paju-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 7,327,015
- Issue date Feb 5, 2008
- Advanced Semiconductor Engineering, Inc.
- JunYoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation method used in leadless packaging process
- Patent number 6,489,218
- Issue date Dec 3, 2002
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20080150095
- Publication date Jun 26, 2008
- Advanced Semiconductor Engineering, Inc.
- JunYoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package
- Publication number 20060060953
- Publication date Mar 23, 2006
- JunYoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION METHOD USED IN LEADLESS PACKAGING PROCESS
- Publication number 20020197826
- Publication date Dec 26, 2002
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS