Junichi Arima

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure of semiconductor integrated circuit devic...
- Patent number 5,488,014
- Issue date Jan 30, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of semiconductor integrated circuit device
- Patent number 5,313,101
- Issue date May 17, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor device
- Patent number 5,270,253
- Issue date Dec 14, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a silicide film
- Patent number 4,983,547
- Issue date Jan 8, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Junichi Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of producing same
- Patent number 4,922,321
- Issue date May 1, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 4,896,204
- Issue date Jan 23, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for making the same
- Patent number 4,884,120
- Issue date Nov 28, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for laser-cutting metal interconnections in a semiconduct...
- Patent number 4,745,258
- Issue date May 17, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Junichi Arima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser polishing semiconductor wafer
- Patent number 4,731,516
- Issue date Mar 15, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Takeshi Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cutting metal interconnections in a semiconductor device
- Patent number 4,720,620
- Issue date Jan 19, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Junichi Arima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Junichi Arima

Person

Patents Grantslast 30 patents

Interconnection structure of semiconductor integrated circuit devic...

Interconnection structure of semiconductor integrated circuit device

Method of producing semiconductor device

Method of forming a silicide film

Semiconductor device and a method of producing same

Semiconductor device and method of manufacturing thereof

Semiconductor device and method for making the same

Apparatus for laser-cutting metal interconnections in a semiconduct...

Laser polishing semiconductor wafer

Method of cutting metal interconnections in a semiconductor device