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Junichi KAKEHATA
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Chiyoda-ku, Tokyo, JP
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last 30 patents
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Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...
Publication number
20240105653
Publication date
Mar 28, 2024
Resonac Corporation
Yoshinori EJIRI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20230060577
Publication date
Mar 2, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FO...
Publication number
20230042727
Publication date
Feb 9, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR