Junichi Katayama

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a Cu interconnect pattern
- Patent number 6,607,981
- Issue date Aug 19, 2003
- NEC Corporation
- Hisaya Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...