Junichi Nagata

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesiveless copper clad laminates and printed circuit board having...
- Patent number 9,232,649
- Issue date Jan 5, 2016
- Sumitomo Metal Mining Co., Ltd.
- Junichi Nagata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesiveless copper clad laminates and method for manufacturing the...
- Patent number 8,318,320
- Issue date Nov 27, 2012
- Sumitomo Metal Mining Co., Ltd.
- Junichi Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesiveless copper clad laminates and method for manufacturing the...
- Patent number 8,288,011
- Issue date Oct 16, 2012
- Sumitomo Metal Mining Co., Ltd.
- Junichi Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
LAMINATED SUBSTRATE, CONDUCTIVE SUBSTRATE, METHOD FOR FABRICATING L...
- Publication number 20180181232
- Publication date Jun 28, 2018
- Sumitomo Metal Mining Co., Ltd.
- Junichi NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE SUBSTRATE
- Publication number 20180072019
- Publication date Mar 15, 2018
- Sumitomo Metal Mining Co., Ltd.
- Takumi SHIMOJI
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVELESS COPPER CLAD LAMINATES AND PRINTED CIRCUIT BOARD HAVING...
- Publication number 20140102773
- Publication date Apr 17, 2014
- Sumitomo Metal Mining Co., Ltd.
- Junichi Nagata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesiveless copper clad laminates and method for manufacturing the...
- Publication number 20110081557
- Publication date Apr 7, 2011
- Junichi Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesiveless copper clad laminates and method for manufacturing the...
- Publication number 20110059334
- Publication date Mar 10, 2011
- Junichi Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesiveless Copper Clad Laminates And Method For Manufacturing The...
- Publication number 20080102305
- Publication date May 1, 2008
- SUMITOMO METAL MINING CO., LTD.
- Junichi Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesiveless Copper Clad Laminates And Method For Manufacturing The...
- Publication number 20080090095
- Publication date Apr 17, 2008
- SUMITOMO METAL MINING CO., LTD.
- Junichi Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Junichi Nagata

Person

Patents Grantslast 30 patents

Adhesiveless copper clad laminates and printed circuit board having...

Adhesiveless copper clad laminates and method for manufacturing the...

Adhesiveless copper clad laminates and method for manufacturing the...

Patents Applicationslast 30 patents

LAMINATED SUBSTRATE, CONDUCTIVE SUBSTRATE, METHOD FOR FABRICATING L...

CONDUCTIVE SUBSTRATE

ADHESIVELESS COPPER CLAD LAMINATES AND PRINTED CIRCUIT BOARD HAVING...

Adhesiveless copper clad laminates and method for manufacturing the...

Adhesiveless copper clad laminates and method for manufacturing the...

Adhesiveless Copper Clad Laminates And Method For Manufacturing The...

Adhesiveless Copper Clad Laminates And Method For Manufacturing The...