Junichi UENO

Person

Nishishirakawa-gun, Fukushima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing apparatus with a waste liquid receiver
- Patent number 10,850,365
- Issue date Dec 1, 2020
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 10,537,972
- Issue date Jan 21, 2020
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and wafer polishing method
- Patent number 10,532,442
- Issue date Jan 14, 2020
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 10,414,017
- Issue date Sep 17, 2019
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad and method for manufacturing the same
- Patent number 10,201,886
- Issue date Feb 12, 2019
- FUJIBO HOLDINGS, INC.
- Michito Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for dressing urethane foam pad for use in polishing
- Patent number 9,981,361
- Issue date May 29, 2018
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for a double-side polishing apparatus, double-side polishin...
- Patent number 9,327,382
- Issue date May 3, 2016
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing apparatus
- Patent number 8,834,234
- Issue date Sep 16, 2014
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, manufacturing method thereof and polishing method
- Patent number 8,545,291
- Issue date Oct 1, 2013
- Fujibo Holdings Inc.
- Kohki Itoyama
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 8,454,410
- Issue date Jun 4, 2013
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for double-side polishing apparatus, double-side polishing...
- Patent number 8,118,646
- Issue date Feb 21, 2012
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing method for wafer
- Patent number 7,727,053
- Issue date Jun 1, 2010
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Process for manufacturing semiconductor wafer and semiconductor wafer
- Patent number 6,729,941
- Issue date May 4, 2004
- Shin-Etsu Handotai & Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SINGLE-SIDE POLISHING APPARATUS, SINGLE-SIDE POLISHING METHOD, AND...
- Publication number 20230330804
- Publication date Oct 19, 2023
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND WAFER POLISHING METHOD
- Publication number 20210023673
- Publication date Jan 28, 2021
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20180229344
- Publication date Aug 16, 2018
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20180222008
- Publication date Aug 9, 2018
- Shin-Etsu Handotai Co., Ltd.
- Michito SATO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20170304986
- Publication date Oct 26, 2017
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND WAFER POLISHING METHOD
- Publication number 20170304992
- Publication date Oct 26, 2017
- Shin-Etsu Handotai Co., Ltd.
- Michito SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170144266
- Publication date May 25, 2017
- Shin-Etsu Handotai Co., Ltd
- Michito SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DRESSING URETHANE FOAM PAD FOR USE IN POLISHING
- Publication number 20160214230
- Publication date Jul 28, 2016
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20120329373
- Publication date Dec 27, 2012
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD, MANUFACTURING METHOD THEREOF AND POLISHING METHOD
- Publication number 20120100783
- Publication date Apr 26, 2012
- Shin-Etsu Handotai Co., Ltd.
- Kohki Itoyama
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...
- Publication number 20110124271
- Publication date May 26, 2011
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER FOR A DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHIN...
- Publication number 20110104995
- Publication date May 5, 2011
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20100144249
- Publication date Jun 10, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Application
Double-Side Polishing Method for Wafer
- Publication number 20090124175
- Publication date May 14, 2009
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
Carrier For Double-Side Polishing Apparatus, Double-Side Polishing...
- Publication number 20080166952
- Publication date Jul 10, 2008
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
Wafer-retaining carrier, double-side grinding device using the same...
- Publication number 20060178089
- Publication date Aug 10, 2006
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
Process for manufacturing semiconductor wafer and semiconductor wafer
- Publication number 20040224519
- Publication date Nov 11, 2004
- SHIN-ETSU HANDOTAI CO., LTD.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
Method for producing semiconductor wafer and semiconductor wafer
- Publication number 20020137313
- Publication date Sep 26, 2002
- Junichi Ueno
- B24 - GRINDING POLISHING

Junichi UENO

Person

Patents Grantslast 30 patents

Polishing apparatus with a waste liquid receiver

Polishing method and polishing apparatus

Polishing apparatus and wafer polishing method

Polishing apparatus

Polishing pad and method for manufacturing the same

Apparatus for dressing urethane foam pad for use in polishing

Carrier for a double-side polishing apparatus, double-side polishin...

Double-side polishing apparatus

Polishing pad, manufacturing method thereof and polishing method

Polishing apparatus

Carrier for double-side polishing apparatus, double-side polishing...

Double-side polishing method for wafer

Process for manufacturing semiconductor wafer and semiconductor wafer

Patents Applicationslast 30 patents

SINGLE-SIDE POLISHING APPARATUS, SINGLE-SIDE POLISHING METHOD, AND...

POLISHING HEAD AND WAFER POLISHING METHOD

POLISHING METHOD AND POLISHING APPARATUS

POLISHING APPARATUS

POLISHING APPARATUS

POLISHING APPARATUS AND WAFER POLISHING METHOD

POLISHING PAD AND METHOD FOR MANUFACTURING THE SAME

APPARATUS FOR DRESSING URETHANE FOAM PAD FOR USE IN POLISHING

DOUBLE-SIDE POLISHING APPARATUS

POLISHING PAD, MANUFACTURING METHOD THEREOF AND POLISHING METHOD

CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...

CARRIER FOR A DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHIN...

POLISHING APPARATUS

Double-Side Polishing Method for Wafer

Carrier For Double-Side Polishing Apparatus, Double-Side Polishing...

Wafer-retaining carrier, double-side grinding device using the same...

Process for manufacturing semiconductor wafer and semiconductor wafer

Method for producing semiconductor wafer and semiconductor wafer