Junichiro Yoshioka

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate plating jig
- Patent number 9,865,493
- Issue date Jan 9, 2018
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 9,714,476
- Issue date Jul 25, 2017
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition method
- Patent number 9,624,596
- Issue date Apr 18, 2017
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition method
- Patent number 9,593,430
- Issue date Mar 14, 2017
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition method
- Patent number 9,506,162
- Issue date Nov 29, 2016
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition method
- Patent number 9,388,505
- Issue date Jul 12, 2016
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 8,961,755
- Issue date Feb 24, 2015
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition apparatus
- Patent number 8,936,705
- Issue date Jan 20, 2015
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 8,337,680
- Issue date Dec 25, 2012
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder, plating apparatus, and plating method
- Patent number 8,133,376
- Issue date Mar 13, 2012
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 8,075,756
- Issue date Dec 13, 2011
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method
- Patent number 8,012,332
- Issue date Sep 6, 2011
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 7,901,551
- Issue date Mar 8, 2011
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 7,833,393
- Issue date Nov 16, 2010
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder, plating apparatus, and plating method
- Patent number 7,807,027
- Issue date Oct 5, 2010
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 7,601,248
- Issue date Oct 13, 2009
- Ebara Corporation
- Junichiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and method
- Patent number 7,402,227
- Issue date Jul 22, 2008
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and apparatus
- Patent number 7,118,664
- Issue date Oct 10, 2006
- Ebara Corporation
- Junichiro Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 7,022,211
- Issue date Apr 4, 2006
- Ebara Corporation
- Junichiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder, plating apparatus, and plating method
- Patent number 6,844,274
- Issue date Jan 18, 2005
- Ebara Corporation
- Junichiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and apparatus
- Patent number 6,716,332
- Issue date Apr 6, 2004
- Ebara Corporation
- Junichiro Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor element and fabricating method thereof
- Patent number 6,569,752
- Issue date May 27, 2003
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for detecting the conductivity between plating co...
- Patent number 6,500,317
- Issue date Dec 31, 2002
- Ebara Corporation
- Junichiro Yoshioka
- G01 - MEASURING TESTING
Information Patent Grant
Wafer plating jig
- Patent number 6,365,020
- Issue date Apr 2, 2002
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Spin processing apparatus
- Patent number 6,269,548
- Issue date Aug 7, 2001
- Ebara Corporation
- Hiroyuki Shinozaki
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method for making alkanol-or alkane-sulfone plumbate
- Patent number 6,242,624
- Issue date Jun 5, 2001
- Ebara Corporation
- Junichiro Yoshioka
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCHEMICAL DEPOSITION METHOD
- Publication number 20160319455
- Publication date Nov 3, 2016
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION METHOD
- Publication number 20160319454
- Publication date Nov 3, 2016
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION METHOD
- Publication number 20160319456
- Publication date Nov 3, 2016
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PLATING DEVICE
- Publication number 20160138181
- Publication date May 19, 2016
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PLATING JIG
- Publication number 20150294894
- Publication date Oct 15, 2015
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION METHOD
- Publication number 20150136610
- Publication date May 21, 2015
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...
- Publication number 20150122635
- Publication date May 7, 2015
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PLATING JIG AND PLATING DEVICE USING SAME
- Publication number 20150068890
- Publication date Mar 12, 2015
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE ELECTROPLATING JIG
- Publication number 20140251798
- Publication date Sep 11, 2014
- JCU CORPORATION
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemical deposition apparatus
- Publication number 20130081941
- Publication date Apr 4, 2013
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20130015075
- Publication date Jan 17, 2013
- Masahiko SEKIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...
- Publication number 20120048727
- Publication date Mar 1, 2012
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20110127159
- Publication date Jun 2, 2011
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...
- Publication number 20110036722
- Publication date Feb 17, 2011
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, PLATING APPARATUS, AND PLATING METHOD
- Publication number 20100320090
- Publication date Dec 23, 2010
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate Holder and Plating Apparatus
- Publication number 20100000858
- Publication date Jan 7, 2010
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20090301395
- Publication date Dec 10, 2009
- Masahiko SEKIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND METHOD
- Publication number 20080245669
- Publication date Oct 9, 2008
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor wafer holder and electroplating system for plating a...
- Publication number 20060151317
- Publication date Jul 13, 2006
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20060141157
- Publication date Jun 29, 2006
- Masahiko Sekimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20060081478
- Publication date Apr 20, 2006
- Tsuyoshi Sahoda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate holder, plating apparatus, and plating method
- Publication number 20050092600
- Publication date May 5, 2005
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20050082163
- Publication date Apr 21, 2005
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate holder and plating apparatus
- Publication number 20050014368
- Publication date Jan 20, 2005
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and apparatus
- Publication number 20040159550
- Publication date Aug 19, 2004
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate holder, plating apparatus, and plating method
- Publication number 20040037682
- Publication date Feb 26, 2004
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor wafer holder and electroplating system for plating a...
- Publication number 20020029963
- Publication date Mar 14, 2002
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20020027080
- Publication date Mar 7, 2002
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Junichiro Yoshioka

Person

Patents Grantslast 30 patents

Substrate plating jig

Semiconductor wafer holder and electroplating system for plating a...

Electrochemical deposition method

Electrochemical deposition method

Electrochemical deposition method

Electrochemical deposition method

Semiconductor wafer holder and electroplating system for plating a...

Electrochemical deposition apparatus

Substrate holder and plating apparatus

Substrate holder, plating apparatus, and plating method

Semiconductor wafer holder and electroplating system for plating a...

Plating apparatus and method

Substrate holder and plating apparatus

Semiconductor wafer holder and electroplating system for plating a...

Substrate holder, plating apparatus, and plating method

Substrate holder and plating apparatus

Plating apparatus and method

Plating method and apparatus

Semiconductor wafer holder and electroplating system for plating a...

Substrate holder, plating apparatus, and plating method

Plating method and apparatus

Semiconductor element and fabricating method thereof

Plating apparatus for detecting the conductivity between plating co...

Wafer plating jig

Spin processing apparatus

Method for making alkanol-or alkane-sulfone plumbate

Patents Applicationslast 30 patents

ELECTROCHEMICAL DEPOSITION METHOD

ELECTROCHEMICAL DEPOSITION METHOD

ELECTROCHEMICAL DEPOSITION METHOD

SUBSTRATE PLATING DEVICE

SUBSTRATE PLATING JIG

ELECTROCHEMICAL DEPOSITION METHOD

SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...

SUBSTRATE PLATING JIG AND PLATING DEVICE USING SAME

SUBSTRATE ELECTROPLATING JIG

Electrochemical deposition apparatus

PLATING APPARATUS AND PLATING METHOD

SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...

SUBSTRATE HOLDER AND PLATING APPARATUS

SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...

SUBSTRATE HOLDER, PLATING APPARATUS, AND PLATING METHOD

Substrate Holder and Plating Apparatus

PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS AND METHOD

Semiconductor wafer holder and electroplating system for plating a...

Plating apparatus and plating method

Plating apparatus and plating method

Substrate holder, plating apparatus, and plating method

Plating apparatus and method

Substrate holder and plating apparatus

Plating method and apparatus

Substrate holder, plating apparatus, and plating method

Semiconductor wafer holder and electroplating system for plating a...

Plating apparatus and method