Junjun Liu

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Albany, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging method and integrated packaging circuit
- Patent number 11,335,664
- Issue date May 17, 2022
- SHENZHEN XlUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging structure and method
- Patent number 11,183,458
- Issue date Nov 23, 2021
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system and packaging method therefor
- Patent number 10,930,634
- Issue date Feb 23, 2021
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging method and integrated packaged circuit
- Patent number 10,867,959
- Issue date Dec 15, 2020
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip wiring method and structure
- Patent number 10,847,496
- Issue date Nov 24, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit multichip stacked packaging structure and method
- Patent number 10,615,151
- Issue date Apr 7, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Packaging Method and Integrated Packaging Circuit
- Publication number 20200043886
- Publication date Feb 6, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit system and packaging method therefor
- Publication number 20200006310
- Publication date Jan 2, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Multichip Stacked Packaging Structure and Method
- Publication number 20190326261
- Publication date Oct 24, 2019
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packaging Method and Integrated Packaged Circuit
- Publication number 20190326207
- Publication date Oct 24, 2019
- Shenzhen Xiuyuan Electronic Technology Co., Ltd.
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Wiring Method and Structure
- Publication number 20190295982
- Publication date Sep 26, 2019
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packaging Structure and Method
- Publication number 20190287909
- Publication date Sep 19, 2019
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS