Junko Izumitani

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, and manufacturing method thereof
- Patent number 8,008,730
- Issue date Aug 30, 2011
- Renesas Electronics Corporation
- Shoichi Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including fuse elements and bonding pad
- Patent number 7,423,301
- Issue date Sep 9, 2008
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including bonding pad...
- Patent number 7,335,537
- Issue date Feb 26, 2008
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including fuse elements and bonding pad
- Patent number 7,217,965
- Issue date May 15, 2007
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer wiring structure and pad e...
- Patent number 6,890,857
- Issue date May 10, 2005
- Renesas Technology Corp.
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with internal bonding pad
- Patent number 6,727,590
- Issue date Apr 27, 2004
- Renesas Technology Corp.
- Junko Izumitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 6,645,863
- Issue date Nov 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hiroki Takewaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device having capacitive element
- Patent number 6,500,675
- Issue date Dec 31, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer wiring structure and pad e...
- Patent number 6,476,491
- Issue date Nov 5, 2002
- Mitsubishi Denki Kabushiki Kaihsa
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,476,496
- Issue date Nov 5, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Junko Izumitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and apparatus and method for manufacturing the...
- Patent number 6,333,259
- Issue date Dec 25, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Junko Izumitani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inspection data analyzing apparatus for in-line inspection with enh...
- Patent number 6,016,562
- Issue date Jan 18, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Yoko Miyazaki
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20100052062
- Publication date Mar 4, 2010
- RENESAS TECHNOLOGY CORP.
- Shoichi Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including fuse elements and bonding pad
- Publication number 20090001508
- Publication date Jan 1, 2009
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including fuse elements and bonding pad
- Publication number 20070176257
- Publication date Aug 2, 2007
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device including bonding pad...
- Publication number 20070176258
- Publication date Aug 2, 2007
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040195648
- Publication date Oct 7, 2004
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of electronic device having wiring connection...
- Publication number 20040157464
- Publication date Aug 12, 2004
- Renesas Technology Corp.
- Junko Izumitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure
- Publication number 20040017279
- Publication date Jan 29, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having capacitive element and manufacturing me...
- Publication number 20030109100
- Publication date Jun 12, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20030100177
- Publication date May 29, 2003
- Hiroki Takewaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030080428
- Publication date May 1, 2003
- MITSUBISHI DENKI KABUSHIKI
- Junko Izumitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a multilayer wiring structure and pad e...
- Publication number 20030052339
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20020177325
- Publication date Nov 28, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hiroki Takewaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact structure, semiconductor device and manufacturing method th...
- Publication number 20020081836
- Publication date Jun 27, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hiroki Takewaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having capacitive element and manufacturing me...
- Publication number 20020074587
- Publication date Jun 20, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same and appara...
- Publication number 20010008311
- Publication date Jul 19, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS

Junko Izumitani

Person

Patents Grantslast 30 patents

Semiconductor device, and manufacturing method thereof

Semiconductor device including fuse elements and bonding pad

Method of manufacturing semiconductor device including bonding pad...

Semiconductor device including fuse elements and bonding pad

Semiconductor device having a multilayer wiring structure and pad e...

Semiconductor device with internal bonding pad

Method of manufacturing semiconductor device and semiconductor device

Manufacturing method of semiconductor device having capacitive element

Semiconductor device having a multilayer wiring structure and pad e...

Semiconductor device and method of manufacturing the same

Semiconductor device and apparatus and method for manufacturing the...

Inspection data analyzing apparatus for in-line inspection with enh...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

Semiconductor device including fuse elements and bonding pad

Semiconductor device including fuse elements and bonding pad

Method of manufacturing semiconductor device including bonding pad...

Semiconductor device

Manufacturing method of electronic device having wiring connection...

Wiring structure

Semiconductor device having capacitive element and manufacturing me...

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device having a multilayer wiring structure and pad e...

Method of manufacturing semiconductor device and semiconductor device

Contact structure, semiconductor device and manufacturing method th...

Semiconductor device having capacitive element and manufacturing me...

Semiconductor device and method for fabricating the same and appara...