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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit packaging system with under bump metallization a...
Patent number
9,865,554
Issue date
Jan 9, 2018
STATS ChipPAC Ptc. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of embedding bumps formed on semico...
Patent number
9,257,411
Issue date
Feb 9, 2016
STATS ChipPAC, Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with under bump metallization a...
Patent number
9,202,793
Issue date
Dec 1, 2015
Stats Chippac Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with substrate and method of ma...
Patent number
9,059,157
Issue date
Jun 16, 2015
Stats Chippac Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with transparent encapsulation...
Patent number
8,399,306
Issue date
Mar 19, 2013
Stats Chippac Ltd.
JunMo Koo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION A...
Publication number
20160099222
Publication date
Apr 7, 2016
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Embedding Bumps Formed on Semico...
Publication number
20140231989
Publication date
Aug 21, 2014
STATS ChipPAC, Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MA...
Publication number
20130320525
Publication date
Dec 5, 2013
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSPARENT ENCAPSULATION...
Publication number
20120241927
Publication date
Sep 27, 2012
JunMo Koo
H01 - BASIC ELECTRIC ELEMENTS