Junnan Zhao

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 12,154,715
- Issue date Nov 26, 2024
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 12,087,746
- Issue date Sep 10, 2024
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit package supports
- Patent number 11,830,809
- Issue date Nov 28, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,735,537
- Issue date Aug 22, 2023
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,721,677
- Issue date Aug 8, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors
- Patent number 11,651,885
- Issue date May 16, 2023
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a lateral trace
- Patent number 11,646,254
- Issue date May 9, 2023
- Tahoe Research, LTD.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,557,579
- Issue date Jan 17, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structures in integrated circuit package supports
- Patent number 11,557,489
- Issue date Jan 17, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a cooling channel
- Patent number 11,521,914
- Issue date Dec 6, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effective heat conduction from hotspot to heat spreader through pac...
- Patent number 11,502,017
- Issue date Nov 15, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic bilayer structure for a cored or coreless semiconductor pa...
- Patent number 11,495,555
- Issue date Nov 8, 2022
- Intel Corporation
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,482,471
- Issue date Oct 25, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 11,450,471
- Issue date Sep 20, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film barrier seed metallization in magnetic-plugged through ho...
- Patent number 11,443,885
- Issue date Sep 13, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,443,892
- Issue date Sep 13, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,417,614
- Issue date Aug 16, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material in substrate cavity
- Patent number 11,387,224
- Issue date Jul 12, 2022
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Embedding magnetic material, in a cored or coreless semiconductor p...
- Patent number 11,355,459
- Issue date Jun 7, 2022
- INTEL CORPOATION
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a first level interface
- Patent number 11,322,290
- Issue date May 3, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package substrate formed with dielectric bi-layer
- Patent number 11,276,634
- Issue date Mar 15, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,246,218
- Issue date Feb 8, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Galvanic corrosion protection for semiconductor packages
- Patent number 11,217,534
- Issue date Jan 4, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a second level interface
- Patent number 11,031,360
- Issue date Jun 8, 2021
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 10,971,492
- Issue date Apr 6, 2021
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a lateral trace
- Patent number 10,804,188
- Issue date Oct 13, 2020
- Intel Corporation
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20240405006
- Publication date Dec 5, 2024
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20230352385
- Publication date Nov 2, 2023
- Tahoe Research, Ltd.
- Yikang DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20230238368
- Publication date Jul 27, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR ON A GLASS SUBSTRATE
- Publication number 20230197351
- Publication date Jun 22, 2023
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
- Publication number 20230187205
- Publication date Jun 15, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...
- Publication number 20220367104
- Publication date Nov 17, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
- Publication number 20220359115
- Publication date Nov 10, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...
- Publication number 20220328431
- Publication date Oct 13, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
- Publication number 20220230800
- Publication date Jul 21, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20220230951
- Publication date Jul 21, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...
- Publication number 20220117089
- Publication date Apr 14, 2022
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20210305154
- Publication date Sep 30, 2021
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20210111166
- Publication date Apr 15, 2021
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20210020558
- Publication date Jan 21, 2021
- Intel Corporation
- Yikang DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200402884
- Publication date Dec 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
- Publication number 20200373257
- Publication date Nov 26, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...
- Publication number 20200312738
- Publication date Oct 1, 2020
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200273776
- Publication date Aug 27, 2020
- Intel Corporation
- Cheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GALVANIC CORROSION PROTECTION FOR SEMICONDUCTOR PACKAGES
- Publication number 20200266149
- Publication date Aug 20, 2020
- Intel Corporation
- Cheng XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...
- Publication number 20200251467
- Publication date Aug 6, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
- Publication number 20200211927
- Publication date Jul 2, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20200212020
- Publication date Jul 2, 2020
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...
- Publication number 20200185300
- Publication date Jun 11, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS
- Publication number 20200168384
- Publication date May 28, 2020
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
- Publication number 20200118990
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING
- Publication number 20200119250
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20200083153
- Publication date Mar 12, 2020
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE SUBSTRATE FORMED WITH DIELECTRIC BI-LAYER
- Publication number 20200075473
- Publication date Mar 5, 2020
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20200066543
- Publication date Feb 27, 2020
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
- Publication number 20200027728
- Publication date Jan 23, 2020
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS

Junnan Zhao

Person

Patents Grantslast 30 patents

Methods to selectively embed magnetic materials in substrate and co...

Microelectronic assemblies having an integrated capacitor

Substrate assembly with encapsulated magnetic feature

Vented lids for integrated circuit packages

Magnetic structures in integrated circuit package supports

Methods to embed magnetic material as first layer on coreless subst...

Microelectronic assemblies having an integrated capacitor

Core layer with fully encapsulated co-axial magnetic material aroun...

Magnetic core inductors

Electronic device including a lateral trace

Microelectronic assemblies having an integrated capacitor

Cavity structures in integrated circuit package supports

Microelectronic assemblies having a cooling channel

Effective heat conduction from hotspot to heat spreader through pac...

Magnetic bilayer structure for a cored or coreless semiconductor pa...

Thermal management solutions for integrated circuit packages

Methods to selectively embed magnetic materials in substrate and co...

Thin film barrier seed metallization in magnetic-plugged through ho...

Substrate assembly with encapsulated magnetic feature

Methods to embed magnetic material as first layer on coreless subst...

Phase change material in substrate cavity

Embedding magnetic material, in a cored or coreless semiconductor p...

Magnetic inductor structures for package devices

Techniques for an inductor at a first level interface

High density package substrate formed with dielectric bi-layer

Core layer with fully encapsulated co-axial magnetic material aroun...

Galvanic corrosion protection for semiconductor packages

Techniques for an inductor at a second level interface

Package-embedded thin-film capacitors, package-integral magnetic in...

Electronic device including a lateral trace

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

FILM CAPACITOR ON A GLASS SUBSTRATE

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC

METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...

SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE

METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...

TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...

MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES

TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE

THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

GALVANIC CORROSION PROTECTION FOR SEMICONDUCTOR PACKAGES

PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...

MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...

MAGNETIC CORE INDUCTORS

PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY

IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

HIGH DENSITY PACKAGE SUBSTRATE FORMED WITH DIELECTRIC BI-LAYER

CAVITY STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC